參數(shù)資料
型號(hào)： PCA9674ABS
廠商： NXP Semiconductors N.V.
元件分類： I2C/I2S
英文描述： Remote 8-bit I-O expander for Fm+ I2C-bus with interrupt
封裝： PCA9674ABS<SOT758-1 (HVQFN16)|<<http://www.nxp.com/packages/SOT758-1.html<1<Always Pb-free,;PCA9674AD<SOT162-1 (SO16)|<<http://www.nxp.com/packages/SOT162-1.html<1<
文件頁(yè)數(shù)： 27/32頁(yè)
文件大?。?/td> 299K
代理商： PCA9674ABS
PCA9674_PCA9674A
All information provided in this document is subject to legal disclaimers.
NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 6 — 29 September 2011
27 of 32
NXP Semiconductors
PCA9674; PCA9674A
Remote 8-bit I/O expander for Fm+ I
2
C-bus with interrupt
Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
Solder bath specifications, including temperature and impurities
16.4 Reflow soldering
Key characteristics in reflow soldering are:
Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see
Figure 25
) than a SnPb process, thus
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 9
and
10
Table 9.
Package thickness (mm)
Table 10.
Package thickness (mm)
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see
Figure 25
.
SnPb eutectic process (from J-STD-020C)
Package reflow temperature (
C)
Volume (mm
3
)
< 350
235
220
350
220
220
< 2.5
2.5
Lead-free process (from J-STD-020C)
Package reflow temperature (
C)
Volume (mm
3
)
< 350
260
260
250
350 to 2000
260
250
245
> 2000
260
245
245
< 1.6
1.6 to 2.5
> 2.5
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
PCA9674ABS,118 功能描述:接口-I/O擴(kuò)展器 8-BIT I2C FM+ QB RoHS:否 制造商:NXP Semiconductors 邏輯系列: 輸入/輸出端數(shù)量: 最大工作頻率:100 kHz 工作電源電壓:1.65 V to 5.5 V 工作溫度范圍:- 40 C to + 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:HVQFN-16 封裝:Reel
PCA9674ABS,118-CUT TAPE 制造商:NXP 功能描述:PCA9674 Series 1 MHz 8 bit I/O Expander Fm + I2C Bus with Interrupt - HVQFN-16
PCA9674ABS-T 功能描述:接口-I/O擴(kuò)展器 8-BIT I2C FM+ QB GPIO RST PU RoHS:否 制造商:NXP Semiconductors 邏輯系列: 輸入/輸出端數(shù)量: 最大工作頻率:100 kHz 工作電源電壓:1.65 V to 5.5 V 工作溫度范圍:- 40 C to + 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:HVQFN-16 封裝:Reel
PCA9674AD 功能描述:接口-I/O擴(kuò)展器 8-BIT I2C FM+ QB GPIO INT PU RoHS:否 制造商:NXP Semiconductors 邏輯系列: 輸入/輸出端數(shù)量: 最大工作頻率:100 kHz 工作電源電壓:1.65 V to 5.5 V 工作溫度范圍:- 40 C to + 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:HVQFN-16 封裝:Reel
PCA9674AD,512 功能描述:接口-I/O擴(kuò)展器 8-BIT I2C FM+ QB RoHS:否 制造商:NXP Semiconductors 邏輯系列: 輸入/輸出端數(shù)量: 最大工作頻率:100 kHz 工作電源電壓:1.65 V to 5.5 V 工作溫度范圍:- 40 C to + 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:HVQFN-16 封裝:Reel
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