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參數(shù)資料
| 型號： | PCF85176T |
| 廠商： | NXP SEMICONDUCTORS |
| 元件分類： | 顯示驅(qū)動器 |
| 英文描述： | Universal LCD driver for low multiplex rates |
| 中文描述： | LIQUID CRYSTAL DISPLAY DRIVER, PDSO56 |
| 封裝： | 6.10 MM, PLASTIC, MO-153, SOT364-1, TSSOP-56 |
| 文件頁數(shù)： | 42/47頁 |
| 文件大小： | 405K |
| 代理商： | PCF85176T |
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PCF85176
All information provided in this document is subject to legal disclaimers.
NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 2 — 27 June 2011
42 of 47
NXP Semiconductors
PCF85176
Universal LCD driver for low multiplex rates
16.3 Wave soldering
Key characteristics in wave soldering are:
Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
Solder bath specifications, including temperature and impurities
16.4 Reflow soldering
Key characteristics in reflow soldering are:
Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see
Figure 29
) than a SnPb process, thus
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 22
and
23
Table 22.
Package thickness (mm)
Table 23.
Package thickness (mm)
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see
Figure 29
.
SnPb eutectic process (from J-STD-020C)
Package reflow temperature (
C)
Volume (mm
3
)
< 350
235
220
350
220
220
< 2.5
2.5
Lead-free process (from J-STD-020C)
Package reflow temperature (
C)
Volume (mm
3
)
< 350
260
260
250
350 to 2000
260
250
245
> 2000
260
245
245
< 1.6
1.6 to 2.5
> 2.5
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| PCF85176T/1,118 | 功能描述:LCD 驅(qū)動器 40 SGMT 2640Hz RoHS:否 制造商:Maxim Integrated 數(shù)位數(shù)量:4.5 片段數(shù)量:30 最大時鐘頻率:19 KHz 工作電源電壓:3 V to 3.6 V 最大工作溫度:+ 85 C 最小工作溫度:- 20 C 封裝 / 箱體:PDIP-40 封裝:Tube |
| PCF8522EP | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:I2C Serial EEPROM |
| PCF8522ET | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:I2C Serial EEPROM |
| PCF8523 | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Real-Time Clock (RTC) and calendar |
| PCF8523T | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Save power with small, ultra-efficient RTCs |
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