Remote 8-bit I/O expander for I2
參數(shù)資料
型號(hào): PCF8574TS/3,112
廠商: NXP Semiconductors
文件頁(yè)數(shù): 12/24頁(yè)
文件大?。?/td> 0K
描述: IC I/O EXPANDER I2C 8B 20SSOP
產(chǎn)品培訓(xùn)模塊: I²C Bus Fundamentals
特色產(chǎn)品: NXP - I2C Interface
標(biāo)準(zhǔn)包裝: 75
接口: I²C
輸入/輸出數(shù): 8
中斷輸出:
頻率 - 時(shí)鐘: 100kHz
電源電壓: 2.5 V ~ 6 V
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 20-LSSOP(0.173",4.40mm 寬)
供應(yīng)商設(shè)備封裝: 20-SSOP
包裝: 管件
包括: POR
產(chǎn)品目錄頁(yè)面: 827 (CN2011-ZH PDF)
配用: 568-3615-ND - DEMO BOARD I2C
其它名稱: 568-3988-5
935275672112
PCF8574TDK
PCF8574TDK-ND
2002 Nov 22
2
Philips Semiconductors
Product specication
Remote 8-bit I/O expander for I2C-bus
PCF8574
CONTENTS
1
FEATURES
2
GENERAL DESCRIPTION
3
ORDERING INFORMATION
4
BLOCK DIAGRAM
5
PINNING
5.1
DIP16 and SO16 packages
5.2
SSOP20 package
6
CHARACTERISTICS OF THE I2C-BUS
6.1
Bit transfer
6.2
Start and stop conditions
6.3
System configuration
6.4
Acknowledge
7
FUNCTIONAL DESCRIPTION
7.1
Addressing
7.2
Interrupt output
7.3
Quasi-bidirectional I/Os
8
LIMITING VALUES
9
HANDLING
10
DC CHARACTERISTICS
11
I2C-BUS TIMING CHARACTERISTICS
12
PACKAGE OUTLINES
13
SOLDERING
13.1
Introduction
13.2
Through-hole mount packages
13.2.1
Soldering by dipping or by solder wave
13.2.2
Manual soldering
13.3
Surface mount packages
13.3.1
Reflow soldering
13.3.2
Wave soldering
13.3.3
Manual soldering
13.4
Suitability of IC packages for wave, reflow and
dipping soldering methods
14
DATA SHEET STATUS
15
DEFINITIONS
16
DISCLAIMERS
17
PURCHASE OF PHILIPS I2C COMPONENTS
相關(guān)PDF資料
PDF描述
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PCF8574T/3,512 IC I/O EXPANDER I2C 8B 16SOIC
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
PCF8575 制造商:TI 制造商全稱:Texas Instruments 功能描述:REMOTE 16-BIT I2C AND SMBus I/O EXPANDER WITH INTERRUPT OUTPUT
PCF8575C 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Remote 16-bit I/O expander for I2C-bus
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