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| 型號(hào)： | PEB20324 |
| 廠商： | INFINEON TECHNOLOGIES AG |
| 英文描述： | ICs for Communications |
| 中文描述： | 通信集成電路 |
| 文件頁(yè)數(shù)： | 39/63頁(yè) |
| 文件大?。?/td> | 705K |
| 代理商： | PEB20324 |
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PEB 20324
PEF 20324
Electrical Characteristics
Hardware Reference Manual
39
04.99
5.2
Absolute Maximum Ratings
Note: Stresses above those listed here may cause permanent damage to the device.
Exposure to absolute maximum rating conditions for extended periods may affect
device reliability.
5.3
Table 5-2
Parameter
Thermal Package Resistance Junction to Ambient
Airflow:
without airflow
Thermal Package Characteristics
Thermal Package Characteristics
Table 5-1
Parameter
Absolute Maximum Ratings
Symbol
Limit Values
Unit
min.
max.
Ambient temperature under bias
PEB
PEF
Junction temperature under bias
Storage temperature
Voltage at any pin with respect to ground
ESD robustness
1)
HBM: 1.5 k
, 100 pF
T
A
0
-40
70
85
125
125
V
DD5
+ 0.4
1000
°
C
T
J
T
stg
V
S
V
ESD,HBM
°
C
°
C
V
V
– 65
– 0.4
1)
According to MIL-Std 883D, method 3015.7 and ESD Ass. Standard EOS/ESD-5.1-1993.
The RF Pins 20, 21, 26, 29, 32, 33, 34 and 35 are not protected against voltage stress > 300 V (versus
V
S
or
GND). The high frequency performance prohibits the use of adequate protective structures.
Symbol
Value
Unit
Ambient Temperature:
T
A
=+25°C
θ
JA(0,25)
29
°C/W
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