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| 型號： | pentium II cpu with mobile |
| 廠商： | Intel Corp. |
| 英文描述： | pentium II processor With On-die Cache Mobile Module Connector 2 (MMC-2)(帶緩存和連接器2的奔II處理器) |
| 中文描述： | 奔騰II處理器芯片上緩存手機模塊連接器2（絲裂霉素2）（帶緩存和連接器2的奔二處理器） |
| 文件頁數(shù)： | 45/48頁 |
| 文件大?。?/td> | 537K |
| 代理商： | PENTIUM II CPU WITH MOBILE |
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Intel
a
Pentium
a
II Processor With On-Die Cache Mobile Module MMC-2
45
Hole detail, 3 places
0.762 mm width of EMI containment ring
1.27+/- 0.19 mm board edge to EMI ring
2.54+/-0.19 mm keep-out area
3.81+/-0.19 mm board edge to hole centerline
3.81+/-0.19 mm
4.45 mm diameter grounded ring
+ 0.050 mm
- 0.025 mm
hole diameter
2.413 mm
Figure 16. Standoff Holes, Board Edge Clearance, and EMI Containment Ring
5.3.2
Module Weight
The Pentium II processor with on-die cache mobile module
MMC-2 weighs approximately 50 grams.
6.0
THERMAL SPECIFICATION
6.1
Thermal Design Power
The power handling capability of the system thermal solution
may be reduced to less than the recommended typical
thermal design power (TDP) with the implementation of
firmware/software control or “throttling”, which reduces the
CPU power consumption and dissipation. The typical TDP is
the typical power dissipation under normal operating
conditions at nominal V_CORE (CPU power supply) while
executing the worst case power instruction mix. This
includes the power dissipated by
all
of the relevant
components.
During all operating environments, the processor junction
temperature, T
, must be within the specified range of 0
Celsius to 100 Celsius.
6.2
Thermal Sensor Setpoint
The thermal sensor implements the SMBALERT# signal
described in the SMBus specification. SMBALERT# is
always asserted when the temperature of the processor core
thermal diode or the thermal sensor internal temperature
exceeds either the upper or lower temperature thresholds.
SMBALERT# may also be asserted if the measured
temperature equals either the upper or the lower threshold.
Table 26. Thermal Design Power Specification
Parameter
Typical
Symbol
Notes
TDP
module
Module Thermal Design Power
11.5 W
Module TDP = core, 82433BX, and voltage regulator.
NOTE:
1.
During all operating environments, the processor temperature, T
J
must be within the specified range of 0 Celsius to 100 Celsius.
TDP
module
is a thermal solution design reference point for OEM thermal solution readiness for total module power.
2.
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