參數(shù)資料
型號: PHT2NQ10T
廠商: NXP SEMICONDUCTORS
元件分類: 小信號晶體管
英文描述: N-channel TrenchMOS transistor
中文描述: Si, SMALL SIGNAL, FET
封裝: PLASTIC, SC-73, 4 PIN
文件頁數(shù): 5/12頁
文件大?。?/td> 269K
代理商: PHT2NQ10T
Philips Semiconductors
PHT2NQ10T
N-channel TrenchMOS transistor
Product data
Rev. 01 — 16 October 2001
2 of 12
9397 750 08918
Koninklijke Philips Electronics N.V. 2001. All rights reserved.
5.
Quick reference data
6.
Limiting values
Table 2:
Quick reference data
Symbol Parameter
Conditions
Typ
Max
Unit
VDS
drain-source voltage (DC)
25
°C ≤ to ≤ 150 °C
100
V
ID
drain current (DC)
Tsp =25 °C; VGS =10V
2.5
A
Ptot
total power dissipation
Tsp =25 °C
6.25
W
Tj
junction temperature
150
°C
RDSon
drain-source on-state resistance
VGS = 10 V; ID = 1.75 A
315
430
m
Table 3:
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter
Conditions
Min
Max
Unit
VDS
drain-source voltage (DC)
25
°C ≤ to ≤ 150 °C
100
V
VDGR
drain-gate voltage (DC)
25
°C ≤ to ≤ 150 °C; RGS =20k
100
V
VGS
gate-source voltage (DC)
±20
V
ID
drain current (DC)
Tsp =25 °C; VGS =10V; Figure 2 and 3
2.5
A
Tsp = 100 °C; VGS =10V;
1.6
A
IDM
peak drain current
Tsp =25 °C; pulsed; tp ≤ 10 s; Figure 3
10
A
Ptot
total power dissipation
Tsp =25 °C; Figure 1
6.25
W
Tstg
storage temperature
65
+150
°C
Tj
operating junction temperature
65
+150
°C
Source-drain diode
IS
source (diode forward) current (DC)
Tsp =25 °C
2.5
A
ISM
peak source (diode forward) current Tsp =25 °C; tp ≤ 10 s
10
A
Avalanche ruggedness
EAS
non-repetitive avalanche energy
unclamped inductive load; ID =2.5 A;
tp = 0.2 ms; VDD ≤ 15 V; RGS =50 ;
VGS = 10 V; starting Tj =25 °C; Figure 4
32
mJ
IAS
non-repetitive avalanche current
unclamped inductive load; VDD ≤ 15 V;
RGS =50 ; VGS =10V; Figure 4
2.5
A
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