參數(shù)資料
型號(hào): PIC24FJ128GB110-I/PF
廠商: Microchip Technology
文件頁(yè)數(shù): 17/22頁(yè)
文件大?。?/td> 0K
描述: IC PIC MCU FLASH 100TQFP
標(biāo)準(zhǔn)包裝: 90
系列: PIC® 24F
核心處理器: PIC
芯體尺寸: 16-位
速度: 32MHz
連通性: I²C,SPI,UART/USART,USB OTG
外圍設(shè)備: 欠壓檢測(cè)/復(fù)位,LVD,POR,PWM,WDT
輸入/輸出數(shù): 83
程序存儲(chǔ)器容量: 128KB(43K x 24)
程序存儲(chǔ)器類型: 閃存
RAM 容量: 16K x 8
電壓 - 電源 (Vcc/Vdd): 2 V ~ 3.6 V
數(shù)據(jù)轉(zhuǎn)換器: A/D 16x10b
振蕩器型: 內(nèi)部
工作溫度: -40°C ~ 85°C
封裝/外殼: 100-TQFP
包裝: 托盤
產(chǎn)品目錄頁(yè)面: 648 (CN2011-ZH PDF)
配用: 876-1004-ND - PIC24 BREAKOUT BOARD
PIC24FJ256GB110 FAMILY
DS80369N-page 4
2008-2011 Microchip Technology Inc.
Silicon Errata Issues
1.
Module: Core (RAM Operation)
If a RAM read is performed on the instruction
immediately prior to enabling Doze mode, an extra
read event may occur when Doze mode is
enabled. This has no effect on most SFRs and on
user RAM space. However, this could cause regis-
ters which also perform some action on a read
(such as auto-incrementing a pointer or removing
data from a FIFO buffer) to repeat that action,
possibly resulting in lost data or unexpected
operation.
Work around
Avoid reading registers which perform a second-
ary action (e.g., UARTx and SPIx’s FIFO buffers,
and the RTCVAL registers) immediately prior to
entering Doze mode.
If this cannot be avoided, execute a NOP
instruction before entering Doze mode.
Affected Silicon Revisions
2.
Module: Core (BOR)
When the on-chip regulator is enabled (ENVREG
tied to VDD), a BOR event may spontaneously
occur under the following circumstances:
VDD is less than 2.5V, and either:
the internal band gap reference is being used as
a reference with the A/D Converter
(AD1PCFG2<1> or <0> = 1) or comparators
(CMxCON<1:0> = 11); or
the CTMU or the USB module is enabled.
Work around
Limit the following activities to only those times
when the on-chip regulator is not in Tracking mode
(LVDIF (IFS4<8>) = 0):
Enabling the USB or CTMU modules
Selecting the internal band gap as a reference
for the A/D Converter or the comparators
Affected Silicon Revisions
3.
Module: JTAG (Device Programming)
The JTAGEN Configuration bit can be pro-
grammed to ‘0’ while using the JTAG interface for
device programming. This may cause a situation
where JTAG programming can lock itself out of
being able to program the device.
Work around
None.
Affected Silicon Revisions
4
Module: UART
When the UARTx is operating using two Stop bits
(STSEL = 1), it may sample the first Stop bit
instead of the second one. If the device being
communicated with is one using one Stop bit in its
communications, this may lead to framing errors.
Work around
None.
Affected Silicon Revisions
5.
Module: I/O (PORTB)
When RB5 is configured as an open-drain output,
it remains in a high-impedance state. The settings
of LATB5 and TRISB5 have no effect on the pin’s
state.
Work around
If open-drain operation is not required, configure
RB5 as a regular I/O (ODCB<5> = 0).
If open-drain operation is required, there are two
options:
Select a different I/O pin for the open-drain
function
Place an external transistor on the pin and
configure the pin as a regular I/O
Affected Silicon Revisions
Note:
This document summarizes all silicon
errata issues from all revisions of silicon,
previous as well as current. Only the
issues indicated by the shaded column in
the following tables apply to the current
silicon revision (A6).
A3
A5
A6
XX
X
A3
A5
A6
XX
X
A3
A5
A6
XX
X
A3
A5
A6
X
A3
A5
A6
X
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