參數(shù)資料
型號(hào)： PLC18V8Z35DB
廠商： NXP SEMICONDUCTORS
元件分類： PLD
英文描述： Zero standby power CMOS versatile PAL devices
中文描述： OT PLD, 35 ns, PDSO20
封裝： 5.30 MM, PLASTIC, MO-150AE, SOT-339-1, SSOP-20
文件頁(yè)數(shù)： 3/23頁(yè)
文件大?。?/td> 225K
代理商： PLC18V8Z35DB
Philips Semiconductors
Product specification
PLC18V8Z
Zero standby power
CMOS versatile PAL devices
1997 Aug 08
3
ORDERING INFORMATION
DESCRIPTION
TEMPERATURE
RANGE
ORDER CODE
DRAWING
NUMBER
SOT146-1
20-Pin (300mil-wide) Plastic Dual In-Line Package, 25ns t
PD
20-Pin (350mil square) Plastic Leaded Chip Carrier Package
PLC18V8Z25N
PLC18V8Z25A
SOT380-1
20-Pin (300mil-wide) Plastic Small Outline Large Package
PLC18V8Z25D
SOT163-1
20-Pin (5.3mm-wide) Plastic Shrink Small Outline Package
PLC18V8Z25DB
SOT339-1
20-Pin (4.4mm-wide) Plastic Thin Shrink Small Outline Package
Commercial
Temperature Range
±
5% Power Supplies
PLC18V8Z25DH
SOT360-1
20–Pin (300mil–wide) Plastic Dual In–Line Package. 35ns t
PD
20–Pin (350mil square) Plastic Leaded Chip Carrier Package
PLC18V8Z35N
SOT146–1
PLC18V8Z35A
SOT380–1
20–Pin (300mil square) Plastic Small Outline Large Package Package
PLC18V8Z35D
SOT163–1
20–Pin (5.3mm–wide) Plastic Shrink Small Outline Package
PLC18V8Z35DB
SOT339–1
20–Pin (4.4mm–wide) Plastic Thin shrink Small Outline Package
PLC18V8Z35DH
SOT260–1
20-Pin (300mil-wide) Plastic Dual In-Line Package 25ns t
PD
20-Pin (350mil square) Plastic Leaded Chip Carrier Package
PLC18V8ZIAN
SOT146-1
PLC18V8ZIAA
SOT380-1
20-Pin (300mil-wide) Plastic Small Outline Large Package
PLC18V8ZIAD
SOT163-1
20-Pin (5.3mm-wide) Plastic Shrink Small Outline Package
PLC18V8ZIADB
SOT339-1
20-Pin (4.4mm-wide) Plastic Thin Shrink Small Outline Package
Industrial
Temperature Range
±
10% Power Supplies
PLC18V8ZIADH
SOT360-1
20–Pin (300mil–wide) Plastic Dual In–Line Package, 40ns t
PD
20–Pin (350mil square) Plastic Leaded chip Carrier Package
PLC18V8ZIN
SOT146–1
PLC18V8ZIA
SOT380–1
20–Pin (300mil square) Plastic Small Outline Large Package
PLC18V8ZZID
SOT163–1
20–Pin (5.3mm–wide) Plastic Shrink Small Outline Package
PLC18V8ZIDB
SOT339–1
20–Pin (4.4mm–wide) Plastic Thin Shrink Small Outline Package
PLC18V8ZIDH
SOT360–1
相關(guān)PDF資料
PDF描述
PLC18V8Z35DH Zero standby power CMOS versatile PAL devices
PLC18V8Z35N Zero standby power CMOS versatile PAL devices
PLC18V8ZIDH Zero standby power CMOS versatile PAL devices
PLC18V8ZIA Zero standby power CMOS versatile PAL devices
PLC42VA12IA UV-Erasable/OTP PLD
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
PLC18V8Z35DH 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Zero standby power CMOS versatile PAL devices
PLC18V8Z35N 制造商:NXP Semiconductors 功能描述:
PLC18V8Z35ZIA 制造商:未知廠家 制造商全稱:未知廠家 功能描述:UV-Erasable/OTP PLD
PLC18V8Z35ZIFA 制造商:未知廠家 制造商全稱:未知廠家 功能描述:UV-Erasable/OTP PLD
PLC18V8Z35ZIN 制造商:未知廠家 制造商全稱:未知廠家 功能描述:UV-Erasable/OTP PLD
發(fā)布緊急采購(gòu)，3分鐘左右您將得到回復(fù)。

采購(gòu)需求

(若只采購(gòu)一條型號(hào)，填寫一行即可)

發(fā)布成功！您可以繼續(xù)發(fā)布采購(gòu)。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

發(fā)布成功！您可以繼續(xù)發(fā)布采購(gòu)。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

*型號(hào) *數(shù)量 廠商 批號(hào) 封裝
添加更多采購(gòu)

我的聯(lián)系方式

*
*
*