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參數(shù)資料
| 型號(hào)： | PPC440EPx-NpAfffTs |
| 廠商： | Applied Micro Circuits Corp. |
| 英文描述： | PowerPC 440EPx Embedded Processor |
| 中文描述： | 嵌入式處理器的PowerPC 440EPx |
| 文件頁(yè)數(shù)： | 72/94頁(yè) |
| 文件大?。?/td> | 738K |
| 代理商： | PPC440EPX-NPAFFFTS |
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Thermal resistance values for the TE-PBGA package in a convection environment at 6.3 W are as follows:
Parameter
Symbol
Airflow
ft/min
(m/sec)
Unit
Notes
0
(0)
100
(0.51)
200
(1.02)
300
(1.53
400
(2.04)
500
(2.55)
Junction-to-ambient thermal resistance
without heat sink
θ
JA
13.1
11.7
10.9
10.5
10.3
10
°C/W
5
Junction-to-ambient thermal resistance
with heat sink
θ
JA
11.1
8.2
7.2
6.8
6.6
6.3
°C/W
5, 6
Resistance Value
Junction-to-case thermal resistance
θ
JC
3.5
°C/W
5
Junction-to-board thermal resistance
θ
JB
7.3
°C/W
5
Notes:
1. Case temperature, T
C
, is measured at top center of case surface with device soldered to circuit board.
2. T
A
= T
C
P
×θ
CA
, where T
A
is ambient temperature and P is power consumption.
3. T
C Max
=
T
J Max
P
×θ
JC
, where T
J Max
is maximum junction temperature (+125°C) and P is power consumption.
4. The preceding equations assume that the chip is mounted on a board with at least one signal and two power planes.
5. Values in the table were achieved using a JEDEC standard board with the following characteristics: 114.5 mm x 101.6 mm x 1.6 mm, 4
layers. The board has 100 thermal vias (same as the number of thermal balls on the TE-PBGA package).
6. Values for an attached heat sink were achieved with a 35 mm x 35 mm x 15 mm unit (see Thermal Management below), attached with a
0.1 mm thickness of adhesive having a thermal conductivity of 1.3 W/mK.
440EPx – PPC440EPx Embedded Processor
Preliminary Data Sheet
72
AMCC Proprietary
Revision 1.26 – October 15, 2007
Thermal Management
The following heat sink was used in the above thermal analysis:
ALPHA LPD35-15B (35 mm x 35 mm x15 mm)
The heat sink is manufactured by:
Alpha Novatech, Inc. (www.alphanovatech.com)
473 Sapena Court, #12
Santa Clara, CA 95054
Phone: 408-567-8082
Table 17. Package Thermal Specifications
相關(guān)PDF資料 |
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|---|---|
| PPC440EPx-SpAfffTs | PowerPC 440EPx Embedded Processor |
| PPC440EP | Power PC 440EP Embedded Processor |
| PPC440EP-3pbfffCx | Power PC 440EP Embedded Processor |
| PPC440GP-3CC333C | Power PC 440GP Embedded Processor |
| PPC440GP-3CC400C | Power PC 440GP Embedded Processor |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| PPC440EPX-NTA400E | 制造商:AMCC 功能描述:32 BIT POWERPC CORE, UP TO 667 MHZ, 2 10/100/1000 ETHERNET, - Trays |
| PPC440EPX-NTA400EZ | 制造商:AMCC 功能描述:32 BIT POWERPC CORE, UP TO 667 MHZ, 2 10/100/1000 ETHERNET, - Tape and Reel |
| PPC440EPX-NTA533E | 制造商:AMCC 功能描述:32 BIT POWERPC CORE, UP TO 667 MHZ, 2 10/100/1000 ETHERNET, - Trays |
| PPC440EPX-NTA533EZ | 制造商:AMCC 功能描述:32 BIT POWERPC CORE, UP TO 667 MHZ, 2 10/100/1000 ETHERNET, - Tape and Reel |
| PPC440EPX-NTA667E | 制造商:AMCC 功能描述:32 BIT POWERPC CORE, UP TO 667 MHZ, 2 10/100/1000 ETHERNET, - Trays |
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