PT0137(08/04)

Ver:4

10

Data Sheet

PT8R1202

PT

Peric om Technology Inc .

Bluetooth Digital Audio Streaming IC

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Package Diagram

of FPBGA

Notes :

1.

2.

3.

All dimension are in millimeters.

‘e’ represents the basic solder ball grid pitch.

‘M’ represents the basic solder ball matrix size.

And, symbol ‘N’ is the number of balls after depopulating.

‘b’ is measurable at the maximum solder ball diameter after

reflow parallel to primary datum -c-.

Dimension ‘a(chǎn)aa’ is measured parallel to primary datum –c-.

Primary datum –c- and seating plane are defined by the spherical

crowns of the solder balls.

Package surface shall be matte finish charmilles 24 to 27.

Package centering to substrate shall be 0.0760 mm maximum

for both X and Y direction respectively.

Package warp shall be 0.050mm maximum.

10.

Substrate material base is bt resin.

11.

The overall package thickness “A” already considers collapse balls.

12.

Dimension and tolerancing per ASME Y14.5-1994.

4.

5.

6.

7.

8.

9.