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參數(shù)資料
| 型號(hào)： | QW075F1 |
| 英文描述： | Analog IC |
| 中文描述： | 模擬IC |
| 文件頁數(shù)： | 4/20頁 |
| 文件大?。?/td> | 1008K |
| 代理商： | QW075F1 |
4
Lucent Technologies Inc.
Data Sheet
May 2000
dc-dc Converters; 36 to 75 Vdc Input, 3.3 Vdc Output; 33 W to 50 W
QW050F1 and QW075F1 Power Modules:
General Specifications
Feature Specifications
Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature
conditions. See Feature Descriptions for additional information.
Parameter
Remote On/Off Signal Interface
(V
I
= 0 V to 75 V; open collector or equivalent compatible;
signal referenced to V
I
(–) terminal; see Figure 16 and
Feature Descriptions.):
Logic Low—Module On
Logic High—Module Off
Logic Low:
At I
on/off
= 1.0 mA
At V
on/off
= 0.0 V
Logic High:
At I
on/off
= 0.0 μA
Leakage Current
Turn-on Time (See Figures 11 and 12.)
(I
O
= 80% of I
O, max
; V
O
within ±1% of steady state)
Output Voltage Adjustment (See Feature Descriptions.):
Output Voltage Remote-sense Range
Output Voltage Set-point Adjustment Range (trim)
Output Overvoltage Protection
Overtemperature Protection
* These are manufacturing test limits. In some situations, results may differ.
Solder, Cleaning, and Drying Considerations
Post solder cleaning is usually the final circuit-board assembly process prior to electrical testing. The result of inad-
equate circuit-board cleaning and drying can affect both the reliability of a power module and the testability of the
finished circuit-board assembly. For guidance on appropriate soldering, cleaning, and drying procedures, refer to
Lucent Technologies Board-Mounted Power Modules Soldering and CleaningApplication Note (AP97-021EPS).
Parameter
Min
Typ
Max
Unit
Calculated MTBF (I
O
= 80% of I
O, max
; T
C
= 40 °C):
QW050F1
QW075F1
Weight
4,000,000
3,600,000
—
hours
hours
g (oz.)
—
75 (2.7)
Symbol
Min
Typ
Max
Unit
V
on/off
I
on/off
V
on/off
I
on/off
—
0
—
—
—
—
—
—
—
—
20
1.2
1.0
15
50
35
V
mA
V
μA
ms
—
—
—
60
3.8*
—
—
—
—
105
0.5
110
4.5*
—
V
%V
O, nom
V
°C
V
O, sd
T
C
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