- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄373261 > RF_PABASESTATION Novel Material for Improved Quality of RF-PA in Base-Station Applications PDF資料下載
參數(shù)資料
| 型號： | RF_PABASESTATION |
| 英文描述： | Novel Material for Improved Quality of RF-PA in Base-Station Applications |
| 中文描述： | 新型材料的質(zhì)量改進(jìn)的射頻在基地的PA -站的應(yīng)用 |
| 文件頁數(shù)： | 4/7頁 |
| 文件大小： | 2057K |
| 代理商： | RF_PABASESTATION |
using two tones RF signal technique. At the same time RF-electrical parameters (linearity, gain, and
efficiency) were monitored and combined with infrared (IR) thermographs. The loading measurements
were performed at temperatures below and above the typical recommended values. The RF-PA with
impedance matching circuitry (Device Under Test - DUT) were assembled on water-cooled plates with
adjustable flow rate. This feature provided possibility to adjust for several working conditions starting
from low to high and harsh temperatures. LabView based Data Acquisition System (DAQ) was used to
monitor stimulation parameters and perform thermal mapping by means of a set of thermocouples. The
DUTs were separated in 4 groups where each group was stimulated to reach predefined working
conditions. The experiment was adjusted to covered junction temperatures (at surface of the die) in range
of
T
jmax
=160
225
°
C. At the same time, the case temperatures (
T
c
- temperature on the surface of the
flange at the center of symmetry of component, see Fig 3b) were adjusted and varied in range of
T
c
=70
110
°
C. Several series of IR measurements were done to correlate the device power, maximum
junction temperatures and RF-electrical parameters. The DUTs were decapped and black painted for IR
imaging as shown in Fig 3a. Figure 3b shows cross section of the DUT and position of thermocouples for
thermal mapping and characterisation.
a)
b)
Figure 3. a) The RF-PA mounted into impedance matching circuitry (DUT) ready for stimulation and IR imaging.
b) Cross-section view on the DUT for temperature mapping by several thermocouples.
IR measurements with both types of the components (WCu and Cu-laminate) were performed with the
same stimulation and assembly conditions. Results of the measurements are presented in Fig 4. As can be
seen, the Cu-laminate component has nearly 29% reduction in
R
jc
and a more uniform temperature
distribution across the die compared to the standard WCu based device. Such advanced components were
further examined by long-term loadings at elevated temperatures. Results of the IR measurements for the
Cu-laminate component are presented in Fig 5.
Analyzing the thermal resistance in the heat-flow path of Cu-laminate components, the major contributors
can be proportioned as Si die (~35%), die bond (~10%), metal flange (~40%) and the thermal interface
between the component and next level heat-sink (~15%). In addition to a reduction of about 18
35% in
R
jc
, a more uniform temperature distribution across the die and the package was observed. Furthermore,
the Cu-laminate structure with active RF-PA component showed high out-of-plane stability resulting in
remarkable flatness of the flange. Such flatness allowed reduction of interfacial thermal resistances,
sufficient heat transfer and further lowering of
T
jmax
.
For a set of working conditions at elevated temperatures (
T
jmax
= 160-225
o
C
T
c
= 70-110
o
C) the RF
electrical parameters were monitored over long period (1.5 months) to observe stability at severe
loadings. Results of the RF stability experiments with Cu-laminate components are presented in Fig 6. At
elevated junction temperatures, operational window is typically limited by RF electrical properties.
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| RF100-902-928RF | Telecommunication IC |
| RF1029 | TRANSISTOR | BJT | NPN | STX-8 |
| RF1030 | TRANSISTOR | BJT | NPN | STX-8 |
| RF1031 | TRANSISTOR | BJT | NPN | STX-8 |
| RF1032 | TRANSISTOR | BJT | NPN | STX-8 |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| RFP-BL1 | 功能描述:烙鐵 Blade Cartridge 10mm (0.4") RoHS:否 制造商:Weller 產(chǎn)品:Soldering Stations 類型:Digital, Iron, Stand, Cleaner 瓦特:50 W 最大溫度:+ 850 F 電纜類型:US Cord Included |
| RFP-BL2 | 功能描述:烙鐵 Blade Cartridge 16mm (0.63") RoHS:否 制造商:Weller 產(chǎn)品:Soldering Stations 類型:Digital, Iron, Stand, Cleaner 瓦特:50 W 最大溫度:+ 850 F 電纜類型:US Cord Included |
| RFP-BL3 | 功能描述:烙鐵 Blade Cartridge 22mm (0.87") RoHS:否 制造商:Weller 產(chǎn)品:Soldering Stations 類型:Digital, Iron, Stand, Cleaner 瓦特:50 W 最大溫度:+ 850 F 電纜類型:US Cord Included |
| RFPCA191515IMAB3G1 | 功能描述:2.4GHz PCB Trace RF Antenna Connector, IPEX Adhesive 制造商:walsin technology corporation 系列:* 包裝:散裝 零件狀態(tài):有效 頻率組:UHF（2 GHz ~ 3 GHz） 頻率（中心/帶）:2.4GHz 頻率范圍:- 天線類型:PCB 印制線 頻帶數(shù):1 VSWR:- 回波損耗:- 增益:- 功率 - 最大值:- 特性:- 端接:連接器，IPEX 侵入防護(hù):- 安裝類型:膠合劑 高度（最大值）:- 應(yīng)用:- 標(biāo)準(zhǔn)包裝:50 |
| RFPCA200615IM5B3G1 | 功能描述:5GHz PCB Trace RF Antenna Connector, IPEX Male 制造商:walsin technology corporation 系列:- 包裝:散裝 零件狀態(tài):有效 頻率組:SHF（f > 4 GHz） 頻率（中心/帶）:5GHz 頻率范圍:- 天線類型:PCB 印制線 頻帶數(shù):1 VSWR:- 回波損耗:- 增益:- 功率 - 最大值:- 特性:- 端接:連接器，IPEX 公型 侵入防護(hù):- 安裝類型:- 高度（最大值）:- 應(yīng)用:- 標(biāo)準(zhǔn)包裝:50 |
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。