- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄373293 > RM3182A PDF資料下載
參數(shù)資料
| 型號： | RM3182A |
| 文件頁數(shù)： | 8/45頁 |
| 文件大?。?/td> | 287K |
| 代理商： | RM3182A |
第1頁第2頁第3頁第4頁第5頁第6頁第7頁當(dāng)前第8頁第9頁第10頁第11頁第12頁第13頁第14頁第15頁第16頁第17頁第18頁第19頁第20頁第21頁第22頁第23頁第24頁第25頁第26頁第27頁第28頁第29頁第30頁第31頁第32頁第33頁第34頁第35頁第36頁第37頁第38頁第39頁第40頁第41頁第42頁第43頁第44頁第45頁
PRODUCT SPECIFICATION
RM3182
7
Mechanical Dimensions
(continued)
28 Terminal Leadless Chip Carrier (LCC)
DETAIL "A"
B1
A1
A
D2
(j) x 45
L1
L2
DETAIL "A"
E
LID
See Note 1
Index Corner
D
(h) x 45
3 PLCS
4
B3
L3
PLANE 2
PLANE 1
A
A1
B1
B3
D/E
.060
.050
.022
.006
.442
.100
.088
.028
.022
.460
1.52
1.27
.56
.15
11.23
2.54
2.24
.71
.56
11.68
Symbol
Inches
Min.
Max.
Min.
Max.
Millimeters
Notes
D1/E1
D2/E2
e
h
j
L1
L2
L3
.050 BSC
.040 REF
.020 REF
.045
.075
1.27 BSC
1.02 REF
.51 REF
1.14
1.91
7
7
28
28
.300 BSC
.150 BSC
7.62 BSC
3.81 BSC
3, 6
3, 6
2
2, 5
4
4
5
ND/NE
N
.015
.38
.003
.08
.055
.095
1.40
2.41
Notes:
1.
The index feature for terminal 1 identification, optical orientation or
handling purposes, shall be within the shaded index areas shown on
planes 1 and 2. Plane 1 terminal 1 identification may be an extension
of the length of the metallized terminal which shall not
be wider than
the B1 dimension.
Unless otherwise specified, a minimum clearance of .015 inch
(0.38mm) shall be maintained between all metallized features
(e.g., lid, castellations, terminals, thermal pads, etc.).
Dimension "A" controls the overall package thickness. The maximum
"A" dimension is the package height before being solder dipped.
The corner shape (square, notch, radius, etc.) may vary at the
manufacturer's option, from that shown on the drawing. The index
corner shall be clearly unique.
Dimension "B3" minimum and "L3" minimum and the appropriately
derived castellation length define an unobstructed three dimensional
space traversing all of the ceramic layers in which a castellation was
designed. Dimension "B3" maximum and "L3" maximum define the
maximum width and depth of the castellation at any point on its
surface. Measurement of these dimensions may be made prior to
solder dripping.
Chip carriers shall be constructed of a minimum of two ceramic layers.
2.
3.
4.
5.
6.
e
D1
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| RM3182AL | Line Driver |
| RM3182AS | Line Driver |
| RM3183CH | Line Receiver |
| RM3183D | Line Receiver |
| RM4136FKB | Voltage-Feedback Operational Amplifier |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| RM3182AL | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Line Driver |
| RM3182AS | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Line Driver |
| RM3182L | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:ARINC 429 Differential Line Driver |
| RM3182L/883B | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:ARINC 429 Differential Line Driver |
| RM3182S | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:ARINC 429 Differential Line Driver |
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。