參數(shù)資料
型號： RM806
英文描述： RM806: PA Module for TDMA AMPS (824–849 MHz)|PA Modules for TDMA Handsets
中文描述： RM806：功率放大器模塊的TDMA安培（824-849兆赫）|功率放大器模塊的TDMA手機(jī)
文件頁數(shù)： 11/16頁
文件大?。?/td> 764K
代理商： RM806
RM806
Package Dimensions and Pin Description
Power Amplifier Module for TDMA AMPS (824–849 MHz)
100602G
February 7, 2002
Skyworks
11
Package Dimensions and Pin Description
The RM806 is a multi-layer laminate base, overmold encapsulated modular package designed for
surface mount solder attachment to a printed circuit board.
Figure 12. RM806 Package Drawing
100602_002
1
2
3
(PIN 7)
R .500 TYP
6
5
4
5.92/6.15
2.870 (2x)
1.981 (2x)
1.219 (2x)
1.500 TYP
5.92/6.15
.762
2.500
(4x)
TOP VIEWS
2
3
6
5
4
(PIN 1)
FRONT VIEW
NOTE:
Solder mask pattern pad layout as seen
from top looking through package.
All dimensions in millimeters.
Table 5. Pin Description
Pin #
Function
1
VCC1
(1)
2
RF Input
3
VREF
4
VCC2
(1)
5
RF Output
6
GND
(7) GND PAD
GND
(2)
NOTE(S):
(1)
All supply pins may be connected together at the supply.
(2)
Package underside is GND.
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
RM806-14 制造商:Conexant Systems Inc 功能描述:RF Amplifier, Single, 6 Pin, Plastic, LCC 制造商:Skyworks Solutions Inc 功能描述:RF Amplifier, Single, 6 Pin, Plastic, LCC
RM807 制造商:未知廠家 制造商全稱:未知廠家 功能描述:RM807: PA Module for TDMA PCS (1850–1910 MHz)|PA Modules for TDMA Handsets
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