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參數(shù)資料
| 型號： | 935235160112 |
| 廠商： | NXP SEMICONDUCTORS |
| 元件分類： | 總線收發(fā)器 |
| 英文描述： | LVC/LCX/Z SERIES, 16 1-BIT DRIVER, TRUE OUTPUT, PDSO48 |
| 封裝： | 7.50 MM, PLASTIC, MO-118, SOT-370-1, SSOP-48 |
| 文件頁數(shù)： | 7/20頁 |
| 文件大?。?/td> | 100K |
| 代理商： | 935235160112 |
2002 Oct 02
15
Philips Semiconductors
Product specication
16-bit D-type transparent latch with 5 V
tolerant inputs/outputs (3-state)
74LVC16373A;
74LVCH16373A
Suitability of surface mount IC packages for wave and reow soldering methods
Notes
1. For more detailed information on the BGA packages refer to the
“(LF)BGA Application Note” (AN01026); order a copy
from your Philips Semiconductors sales office.
2. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the
“Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”.
3. These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder
cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side,
the solder might be deposited on the heatsink surface.
4. If wave soldering is considered, then the package must be placed at a 45
° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
5. Wave soldering is suitable for LQFP, TQFP and QFP packages with a pitch (e) larger than 0.8 mm; it is definitely not
suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
6. Wave soldering is suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
PACKAGE(1)
SOLDERING METHOD
WAVE
REFLOW(2)
BGA, LBGA, LFBGA, SQFP, TFBGA, VFBGA
not suitable
suitable
HBCC, HBGA, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, HVQFN,
HVSON, SMS
not suitable(3)
suitable
PLCC(4), SO, SOJ
suitable
LQFP, QFP, TQFP
not recommended(4)(5)
suitable
SSOP, TSSOP, VSO
not recommended(6)
suitable
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| 9352370001 | 功能描述:HEAT SHRINK SLEEVE RoHS:是 類別:線纜，導(dǎo)線 - 管理 >> 標(biāo)簽，標(biāo)記 系列:HT-SCE 標(biāo)準(zhǔn)包裝:250 系列:CM-SCE 標(biāo)簽類型:標(biāo)準(zhǔn) 標(biāo)簽尺寸:2.00" x 0.25"（50.8mm x 6.4mm） 顏色:白 材質(zhì):聚烯烴 適用于相關(guān)產(chǎn)品:點(diǎn)陣打印機(jī) 包裝:* 工作溫度:-55°C ~ 135°C 其它名稱:A105291CM-SCE-TP-1/4-4H-9 |
| 935241-0001 | 制造商: 功能描述: 制造商:DIGITRAN 功能描述: 制造商:undefined 功能描述: |
| 935241-1 | 制造商:DIGITRAN 功能描述: 制造商:DTRAN 功能描述: |
| 935245650125 | 制造商:NXP Semiconductors 功能描述:Inverter 1-Element CMOS 5-Pin TSSOP T/R |
| 935248-90 | 制造商:JANCO 功能描述:935248-90 |
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