參數(shù)資料
型號： S10141-1109S
廠商： Hamamatsu Photonics
英文描述： CCD area image sensor Low readout noise, high resolution (pixel size: 12 レm)
中文描述： 防治荒漠化領域的圖像傳感器讀出低噪音，高清晰度（像素尺寸：12レ米）
文件頁數(shù)： 7/8頁
文件大?。?/td> 206K
代理商： S10141-1109S
CCD area image sensor
S10140/S10141 series
I
Pin connections
S10140 series
S10141 series
Pin
No.
Symbol
Function
Symbol
Function
Remark
(standard
operation)
+12 V
R
L
=100 k
+24 V
+3 V
Same pulse as P2H
Connect to RD
Same pulse as P2V
GND
Connect to RD
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
RD
OS
OD
OG
SG
-
-
P2H
P1H
IG2H
IG1H
ISH
TG *
15
P2V
P1V
-
-
-
-
SS
ISV
IG2V
IG1V
RG
Reset drain
Output transistor source
Output transistor drain
Output gate
Summing gate
CCD horizontal register clock-2
CCD horizontal register clock-1
Test point (horizontal input gate-2)
Test point (horizontal input gate-1)
Test point (horizontal input source)
Transfer gate
CCD vertical register clock-2
CCD vertical register clock-1
Substrate (GND)
Test point (vertical input source)
Test point (vertical input gate-2)
Test point (vertical input gate-1)
Reset gate
RD
OS
OD
OG
SG
-
-
P2H
P1H
IG2H
IG1H
ISH
TG *
15
P2V
P1V
Th1
Th2
P-
P+
SS
ISV
IG2V
IG1V
RG
Reset drain
Output transistor source
Output transistor drain
Output gate
Summing gate
CCD horizontal register clock-2
CCD horizontal register clock-1
Test point (horizontal input gate-2)
Test point (horizontal input gate-1)
Test point (horizontal input source)
Transfer gate
CCD vertical register clock-2
CCD vertical register clock-1
Thermistor
Thermistor
TE-cooler-
TE-cooler+
Substrate (GND)
Test point (vertical input source)
Test point (vertical input gate-2)
Test point (vertical input gate-1)
Reset gate
*15: Isolation gate between vertical register and horizontal register. In standard operation, TG should be applied the same pulse as
P2V.
I
Specifications of built-in TE-cooler (Typ.)
Parameter
Symbol
Condition
S10141-1007S/-1008S/-1009S
Internal resistance
Rint
Ta=25
°
C
Maximum current *
16
Imax
Tc *
17
=Th *
18
=25
°
C
Maximum voltage
Vmax Tc *
17
=Th *
18
=25
°
C
Maximum heat absorption *
19
Qmax
Maximum temperature
of heat radiating side
*16: Maximum current Imax:
If the current greater than this value flows into the thermoelectric cooler, the heat absorption begins to decrease due to
the Joule heat. It should be noted that this value is not the damage threshold value. To protect the thermoelectric cooler
and maintain stable operation, the supply current should be less than 60 % of this maximum current.
*17: Temperature of the cooling side of thermoelectric cooler.
*18: Temperature of the heat radiating side of thermoelectric cooler.
*19: Maximum heat absorption Qmax.
This is a theoretical heat absorption level that offsets the temperature difference in the thermoelectric cooler when the
maximum current is supplied to the unit.
S10141-1107S/-1108S/-1109S
1.2
3.0
3.6
5.1
Unit
A
V
W
2.5
1.5
3.8
3.4
-
70
70
°
C
0
1
2
3
V
C
C
4
7
6
5
-40
-30
4
3
2
CURRENT (A)
1
0
-20
-10
0
10
20
30
(Typ. Ta=25
C)
VOLTAGE vs. CURRENT
CCD TEMPERATURE vs. CURRENT
0
1
2
3
V
C
C
4
7
6
5
-40
-30
2.0
1.5
1.0
CURRENT (A)
0.5
0
-20
-10
0
10
20
30
(Typ. Ta=25
C)
VOLTAGE vs. CURRENT
CCD TEMPERATURE vs. CURRENT
KMPDB0178EA
KMPDB0179EA
S10141-1007S/-1008S/-1009S
S10141-1107S/-1108S/-1109S
7
相關PDF資料
PDF描述
S10170 RGB color sensor integrated in small and thin package
S10200-02 Diode; Attenuator; VR (V): 30; IF (mA): 100; Pd (mW): 150; rf (ohm) max: 2.5; Condition IF at rf (mA): 10; Condition f at rf (MHz): 100; VF (V) max: 1; Condition IF at VF (mA): 10; C (pF) max: 0.37; Condition VR at C (V): 1; Condition f at C (MHz): 1; Package: SFP
S10201-04 Back-thinned TDI-CCD Operating the back-thinned CCD in TDI mode delivers high sensitivity.
S10202-08 Back-thinned TDI-CCD Operating the back-thinned CCD in TDI mode delivers high sensitivity.
S10202-16 Back-thinned TDI-CCD Operating the back-thinned CCD in TDI mode delivers high sensitivity.
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