參數(shù)資料
型號(hào)： S29GL064A10BAIW12
廠商： SPANSION LLC
元件分類： PROM
英文描述： 4M X 16 FLASH 3V PROM, 100 ns, PBGA64
封裝： FBGA-64
文件頁(yè)數(shù)： 10/97頁(yè)
文件大小： 3490K
代理商： S29GL064A10BAIW12
16
S29GL-A MirrorBit Flash Family
S29GL-A_00_A5 January 11, 2006
Prel imi n ary
Ordering Information–S29GL016A
S29GL016A Standard Products
Standard products are available in several packages and operating ranges. The
order number (Valid Combination) is formed by a combination of the following:
S29GL016A
10
T
A
I
R1
0
PACKING TYPE
0= Tray
2
= 7-inch Tape and Reel
3
= 13-inch Tape and Reel
MODEL NUMBER
R1
= x8/x16, VCC=3.0 – 3.6 V, Top boot sector device, top two address sectors
protected when WP#/ACC=VIL
R2
= x8/x16, VCC=3.0 – 3.6 V, Bottom boot sector device, bottom two address sectors
protected when WP#/ACC=VIL
01
= x8/x16, Vcc = 2.7 - 3.6 V, Top boot sector device, top two address sectors
protected when WP#/ACC = VIL
02
= x8/x16, Vcc = 2.7 - 3.6 V, Bottom boot sector device, bottom two address
sectors protected when WP#/ACC = VIL
W1
= x16, VCC=2.7 – 3.6 V, 56-ball FBGA, top boot sector device*
W2
= x16, VCC=2.7 – 3.6 V, 56-ball FBGA, bottom boot sector device*
*W1 and W2 are MCP-compatible packages for cellular handsets only
TEMPERATURE RANGE
I
= Industrial (–40°C to +85°C)
PACKAGE MATERIAL SET
A= Standard
F= Pb-Free
PACKAGE TYPE
T
= Thin Small Outline Package (TSOP) Standard Pinout
B
= Fine-pitch Ball-Grid Array Package
F
= Fortified Ball-Grid Array Package
SPEED OPTION
See Product Selector Guide and Valid Combinations
DEVICE NUMBER/DESCRIPTION
S29GL016A
3.0 Volt-only, 16 Megabit Page-Mode Flash Memory Manufactured on 200 nm MirrorBit Process Technology.
Table 1. S29GL016A Ordering Options
S29GL016A Valid Combinations
Package Description
(Notes)
Device
Number
Speed
Option
Package, Material,
& Temperature Range
Model
Number
Packing
S29GL016A
90, 10
TAI, TFI
R1, R2
0, 3
TS048 (Note 2)
TSOP
BAI, BFI
0, 2, 3
VBK048 (Note 3)
Fine-Pitch BGA
FAI, FFI
LAA064 (Note 3)
Fortified BGA
10
BAI, BFI
W1, W2
VBU056 (Note 3)
Fine-Pitch BGA
(For cellular handsets only)
10
TAI, TFI
01, 02
0, 3
TS048 (Note 2)
TSOP
BAI, BFI
0, 2, 3
VBK048 (Note 3)
Fine-Pitch BGA
FAI, FFI
LAA064 (Note 3)
Fortified BGA
Notes:
1. Type 0 is standard. Specify others as required: TSOPs can be
packed in Types 0 and 3; BGAs can be packed in Types 0, 2, or 3.
2. TSOP package marking omits packing type designator from
ordering part number.
3. BGA package marking omits leading S29 and packing type
designator from ordering part number.
Valid Combinations
Valid Combinations list configurations planned to be supported in
volume for this device. Consult your local sales office to confirm
availability of specific valid combinations and to check on newly
released combinations.
相關(guān)PDF資料
PDF描述
S29GL128N11FAIVH0 16M X 16 FLASH 3V PROM, 110 ns, PBGA64
S29GL128N11FFIVH2 16M X 16 FLASH 3V PROM, 110 ns, PBGA64
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
S29GL064A10FAIR10 制造商:Spansion 功能描述:FLASH PARALLEL 3V/3.3V 64MBIT 8MX8/4MX16 100NS 64BGA - Trays
S29GL064A10FAIR50 制造商:Spansion 功能描述:FLASH PARALLEL 3V/3.3V 64MBIT 4MX16 100NS 64BGA - Trays
S29GL064A10FFIR30 制造商:Spansion 功能描述:FLASH PARALLEL 3V/3.3V 64MBIT 8MX8/4MX16 100NS 64BGA - Trays
S29GL064A10TAIR42 制造商:Spansion 功能描述:FLASH PARALLEL 3V/3.3V 64MBIT 8MX8/4MX16 100NS 48TSOP - Tape and Reel
S29GL064A10TAIR60 制造商:Spansion 功能描述:FLASH PARALLEL 3V/3.3V 64MBIT 4MX16 100NS 48TSOP - Trays
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