- 您現(xiàn)在的位置：買(mǎi)賣(mài)IC網(wǎng) > PDF目錄372112 > SAA567X (NXP Semiconductors N.V.) Enhanced TV microcontrollers with On-Screen Display (OSD) PDF資料下載
參數(shù)資料
| 型號(hào)： | SAA567X |
| 廠商： | NXP Semiconductors N.V. |
| 英文描述： | Enhanced TV microcontrollers with On-Screen Display (OSD) |
| 中文描述： | 與微控制器在強(qiáng)化電視屏幕顯示（OSD） |
| 文件頁(yè)數(shù)： | 110/116頁(yè) |
| 文件大?。?/td> | 532K |
| 代理商： | SAA567X |
第1頁(yè)第2頁(yè)第3頁(yè)第4頁(yè)第5頁(yè)第6頁(yè)第7頁(yè)第8頁(yè)第9頁(yè)第10頁(yè)第11頁(yè)第12頁(yè)第13頁(yè)第14頁(yè)第15頁(yè)第16頁(yè)第17頁(yè)第18頁(yè)第19頁(yè)第20頁(yè)第21頁(yè)第22頁(yè)第23頁(yè)第24頁(yè)第25頁(yè)第26頁(yè)第27頁(yè)第28頁(yè)第29頁(yè)第30頁(yè)第31頁(yè)第32頁(yè)第33頁(yè)第34頁(yè)第35頁(yè)第36頁(yè)第37頁(yè)第38頁(yè)第39頁(yè)第40頁(yè)第41頁(yè)第42頁(yè)第43頁(yè)第44頁(yè)第45頁(yè)第46頁(yè)第47頁(yè)第48頁(yè)第49頁(yè)第50頁(yè)第51頁(yè)第52頁(yè)第53頁(yè)第54頁(yè)第55頁(yè)第56頁(yè)第57頁(yè)第58頁(yè)第59頁(yè)第60頁(yè)第61頁(yè)第62頁(yè)第63頁(yè)第64頁(yè)第65頁(yè)第66頁(yè)第67頁(yè)第68頁(yè)第69頁(yè)第70頁(yè)第71頁(yè)第72頁(yè)第73頁(yè)第74頁(yè)第75頁(yè)第76頁(yè)第77頁(yè)第78頁(yè)第79頁(yè)第80頁(yè)第81頁(yè)第82頁(yè)第83頁(yè)第84頁(yè)第85頁(yè)第86頁(yè)第87頁(yè)第88頁(yè)第89頁(yè)第90頁(yè)第91頁(yè)第92頁(yè)第93頁(yè)第94頁(yè)第95頁(yè)第96頁(yè)第97頁(yè)第98頁(yè)第99頁(yè)第100頁(yè)第101頁(yè)第102頁(yè)第103頁(yè)第104頁(yè)第105頁(yè)第106頁(yè)第107頁(yè)第108頁(yè)第109頁(yè)當(dāng)前第110頁(yè)第111頁(yè)第112頁(yè)第113頁(yè)第114頁(yè)第115頁(yè)第116頁(yè)
2002 May 06
110
Philips Semiconductors
Objective specification
Enhanced TV microcontrollers with
On-Screen Display (OSD)
SAA567x; SAA569x
33 SOLDERING
33.1
Introduction to soldering surface mount
packages
Thistextgivesaverybriefinsighttoacomplextechnology.
A more in-depth account of soldering ICs can be found in
our “Data Handbook IC26; Integrated Circuit Packages”
(document order number 9398 652 90011).
There is no soldering method that is ideal for all surface
mount IC packages. Wave soldering can still be used for
certainsurfacemountICs,butitisnotsuitableforfinepitch
SMDs. In these situations reflow soldering is
recommended.
33.2
Reflow soldering
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
Several methods exist for reflowing; for example,
convection or convection/infrared heating in a conveyor
type oven. Throughput times (preheating, soldering and
cooling) vary between 100 and 200 seconds depending
on heating method.
Typical reflow peak temperatures range from
215 to 250
°
C. The top-surface temperature of the
packages should preferable be kept below 220
°
C for
thick/large packages, and below 235
°
C for small/thin
packages.
33.3
Wave soldering
Conventional single wave soldering is not recommended
forsurfacemountdevices(SMDs)orprinted-circuitboards
with a high component density, as solder bridging and
non-wetting can present major problems.
To overcome these problems the double-wave soldering
method was specifically developed.
If wave soldering is used the following conditions must be
observed for optimal results:
Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.
For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint
longitudinal axis is
preferred
to be parallel to the
transport direction of the printed-circuit board;
– smaller than 1.27 mm, the footprint longitudinal axis
must
be parallel to the transport direction of the
printed-circuit board.
The footprint must incorporate solder thieves at the
downstream end.
Forpackageswithleadsonfoursides,thefootprintmust
be placed at a 45
°
angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Typical dwell time is 4 seconds at 250
°
C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
33.4
Manual soldering
Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300
°
C.
When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320
°
C.
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| SAA5695HL | Enhanced TV microcontrollers with On-Screen Display (OSD) |
| SAA569x | Enhanced TV microcontrollers with On-Screen Display (OSD) |
| SAA5677HL | Enhanced TV microcontrollers with On-Screen Display (OSD) |
| SAA5700GP | Chinese Character System Teletext CCST decoder |
| SAA5700 | Chinese Character System Teletext CCST decoder |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| SAA5695HL | 制造商:PHILIPS 制造商全稱(chēng):NXP Semiconductors 功能描述:Enhanced TV microcontrollers with On-Screen Display (OSD) |
| SAA5697HL | 制造商:PHILIPS 制造商全稱(chēng):NXP Semiconductors 功能描述:Enhanced TV microcontrollers with On-Screen Display (OSD) |
| SAA569X | 制造商:PHILIPS 制造商全稱(chēng):NXP Semiconductors 功能描述:Enhanced TV microcontrollers with On-Screen Display (OSD) |
| SAA5700 | 制造商:PHILIPS 制造商全稱(chēng):NXP Semiconductors 功能描述:Chinese Character System Teletext CCST decoder |
| SAA5700GP | 制造商:PHILIPS 制造商全稱(chēng):NXP Semiconductors 功能描述:Chinese Character System Teletext CCST decoder |
發(fā)布緊急采購(gòu)，3分鐘左右您將得到回復(fù)。