參數(shù)資料
型號： SAA6721
廠商： NXP Semiconductors N.V.
英文描述： SXGA RGB to TFT graphics engine
中文描述： SXGA RGB到液晶圖形引擎
文件頁數(shù)： 68/72頁
文件大小： 360K
代理商： SAA6721
1999 May 11
68
Philips Semiconductors
Preliminary specification
SXGA RGB to TFT graphics engine
SAA6721E
14.5
Suitability of surface mount IC packages for wave and reflow soldering methods
Notes
1.
All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”
These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
If wave soldering is considered, then the package must be placed at a 45
°
angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
2.
3.
4.
5.
PACKAGE
SOLDERING METHOD
WAVE
REFLOW
(1)
BGA, SQFP
HLQFP, HSQFP, HSOP, SMS
PLCC
(3)
, SO, SOJ
LQFP, QFP, TQFP
SSOP, TSSOP, VSO
not suitable
not suitable
(2)
suitable
not recommended
(3)(4)
not recommended
(5)
suitable
suitable
suitable
suitable
suitable
相關(guān)PDF資料
PDF描述
SAA6721E SXGA RGB to TFT graphics engine(XGA RGB 到 TFT圖形引擎)
SAA6750 Encoder for MPEG2 image recording EMPIRE
SAA6750H Encoder for MPEG2 image recording EMPIRE
SAA6752HS MPEG-2 video and MPEG-audio/AC-3 audio encoder with multiplexer
SAA7102 Circular Connector; MIL SPEC:MIL-C-5015; Body Material:Metal; Series:GT; No. of Contacts:12; Connector Shell Size:28; Connecting Termination:Solder; Circular Shell Style:Straight Plug; Body Style:Straight
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
SAA6721E 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:SXGA RGB to TFT graphics engine
SAA6750 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Encoder for MPEG2 image recording EMPIRE
SAA6750H 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Encoder for MPEG2 image recording EMPIRE
SAA6752HS 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:MPEG-2 video and MPEG-audio/AC-3 audio encoder with multiplexer
SAA6752HS/V103 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:MPEG-2 video and MPEG-audio/AC-3 audio encoder with multiplexer
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