2004 Mar 16
2
Philips Semiconductors
Product specification
PC-CODEC
SAA7108E; SAA7109E
CONTENTS
1
1.1
1.2
1.3
1.4
2
3
4
5
6
7
8
FEATURES
Video decoder
Video scaler
Video encoder
Common features
APPLICATIONS
GENERAL DESCRIPTION
QUICK REFERENCE DATA
ORDERING INFORMATION
BLOCK DIAGRAMS
PINNING
FUNCTIONAL DESCRIPTION OF DIGITAL
VIDEO ENCODER PART
Reset conditions
Input formatter
RGB LUT
Cursor insertion
RGB Y-C
B
-C
R
matrix
Horizontal scaler
Vertical scaler and anti-flicker filter
FIFO
Border generator
Oscillator and Discrete Time Oscillator (DTO)
Low-pass Clock Generation Circuit (CGC)
Encoder
RGB processor
Triple DAC
Timing generator
I
2
C-bus interface
Programming the graphics acquisition scaler of
the video encoder
Input levels and formats
FUNCTIONAL DESCRIPTION OF DIGITAL
VIDEO DECODER PART
Decoder
Decoder output formatter
Scaler
VBI data decoder and capture
(subaddresses 40H to 7FH)
Image port output formatter
(subaddresses 84H to 87H)
Audio clock generation
(subaddresses 30H to 3FH)
INPUT/OUTPUT INTERFACES AND PORTS
OF DIGITAL VIDEO DECODER PART
Analog terminals
Audio clock signals
8.1
8.2
8.3
8.4
8.5
8.6
8.7
8.8
8.9
8.10
8.11
8.12
8.13
8.14
8.15
8.16
8.17
8.18
9
9.1
9.2
9.3
9.4
9.5
9.6
10
10.1
10.2
10.3
10.4
10.5
10.6
Clock and real-time synchronization signals
Video expansion port (X port)
Image port (I port)
Host port for 16-bit extension of video data I/O
(H port)
Basic input and output timing diagrams for the
I and X ports
BOUNDARY SCAN TEST
Initialization of boundary scan circuit
Device identification codes
LIMITING VALUES
THERMAL CHARACTERISTICS
CHARACTERISTICS OF THE DIGITAL
VIDEO ENCODER PART
CHARACTERISTICS OF THE DIGITAL
VIDEO DECODER PART
TIMING
Digital video encoder part
Digital video decoder part
APPLICATION INFORMATION
Analog output voltages
Suggestions for a board layout
I
2
C-BUS DESCRIPTION
Digital video encoder part
Digital video decoder part
PROGRAMMING START SET-UP OF
DIGITAL VIDEO DECODER PART
Decoder part
Audio clock generation part
Data slicer and data type control part
Scaler and interfaces
PACKAGE OUTLINE
SOLDERING
Introduction to soldering surface mount
packages
Reflow soldering
Wave soldering
Manual soldering
Suitability of surface mount IC packages for
wave and reflow soldering methods
DATA SHEET STATUS
DEFINITIONS
DISCLAIMERS
PURCHASE OF PHILIPS I
2
C COMPONENTS
10.7
11
11.1
11.2
12
13
14
15
16
16.1
16.2
17
17.1
17.2
18
18.1
18.2
19
19.1
19.2
19.3
19.4
20
21
21.1
21.2
21.3
21.4
21.5
22
23
24
25