參數(shù)資料
型號(hào)： SAA7114H
廠商： NXP SEMICONDUCTORS
元件分類： 顏色信號(hào)轉(zhuǎn)換
英文描述： PAL/NTSC/SECAM video decoder with adaptive PAL/NTSC comb filter, VBI data slicer and high performance scaler
中文描述： COLOR SIGNAL DECODER, PQFP100
封裝： 14 X 14 MM, 1.40 MM HEIGHT, PLASTIC, MS-026, SOT407-1, LQFP-100
文件頁(yè)數(shù)： 144/147頁(yè)
文件大小： 759K
代理商： SAA7114H
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2004 Mar 03
144
Philips Semiconductors
Product specification
PAL/NTSC/SECAM video decoder with adaptive PAL/NTSC
comb filter, VBI data slicer and high performance scaler
SAA7114
18.5
Suitability of surface mount IC packages for wave and reflow soldering methods
Notes
1.
For more detailed information on the BGA packages refer to the“(LF)BGA Application Note” (AN01026); order a copy
from your Philips Semiconductors sales office.
All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder
cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side,
the solder might be deposited on the heatsink surface.
If wave soldering is considered, then the package must be placed at a 45
°
angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is suitable for LQFP, TQFP and QFP packages with a pitch (e) larger than 0.8 mm; it is definitely not
suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger than
0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
2.
3.
4.
5.
6.
PACKAGE
(1)
SOLDERING METHOD
WAVE
REFLOW
(2)
BGA, LBGA, LFBGA, SQFP, TFBGA, VFBGA
DHVQFN, HBCC, HBGA, HLQFP, HSQFP, HSOP, HTQFP,
HTSSOP, HVQFN, HVSON, SMS
PLCC
(4)
, SO, SOJ
LQFP, QFP, TQFP
SSOP, TSSOP, VSO, VSSOP
not suitable
not suitable
(3)
suitable
suitable
suitable
not recommended
(4)(5)
not recommended
(6)
suitable
suitable
suitable
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
SAA7114H/V2 制造商:NXP Semiconductors 功能描述:7114H/V2557
SAA7114H/V2,518 功能描述:視頻 IC DIGITAL VIDEO DECODER W/COMB F RoHS:否 制造商:Fairchild Semiconductor 工作電源電壓:5 V 電源電流:80 mA 最大工作溫度:+ 85 C 封裝 / 箱體:TSSOP-28 封裝:Reel
SAA7114H/V2,557 功能描述:視頻 IC DECODR W/FILTR RoHS:否 制造商:Fairchild Semiconductor 工作電源電壓:5 V 電源電流:80 mA 最大工作溫度:+ 85 C 封裝 / 箱體:TSSOP-28 封裝:Reel
SAA7114H/V2557 制造商:NXP Semiconductors 功能描述:VIDEO DECODER W/FILTER 100LQFP
SAA7114H_1 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Video decoder
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