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參數(shù)資料
| 型號： | SC16C852VIBS,557 |
| 廠商： | NXP Semiconductors |
| 文件頁數(shù)： | 44/55頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC UART DUAL W/FIFO 48-HVQFN |
| 標(biāo)準(zhǔn)包裝： | 2,450 |
| 特點： | 可編程 |
| 通道數(shù)： | 2，DUART |
| FIFO's： | 128 字節(jié) |
| 規(guī)程： | RS485 |
| 電源電壓： | 2.5V |
| 帶自動流量控制功能： | 是 |
| 帶IrDA 編碼器/解碼器： | 是 |
| 帶故障啟動位檢測功能： | 是 |
| 帶調(diào)制解調(diào)器控制功能： | 是 |
| 帶CMOS： | 是 |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 48-VFQFN 裸露焊盤 |
| 供應(yīng)商設(shè)備封裝： | 48-HVQFN EP（6x6） |
| 包裝： | 托盤 |
| 其它名稱： | 935283102557 SC16C852VIBS SC16C852VIBS-ND |
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SC16C852V
All information provided in this document is subject to legal disclaimers.
NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 5 — 21 January 2011
49 of 55
NXP Semiconductors
SC16C852V
Dual UART with 128-byte FIFOs, IrDA, and XScale VLIO bus interface
12. Soldering of SMD packages
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering ICs can be found in Application Note AN10365 “Surface mount reflow
soldering description”.
12.1 Introduction to soldering
Soldering is one of the most common methods through which packages are attached to
Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both
the mechanical and the electrical connection. There is no single soldering method that is
ideal for all IC packages. Wave soldering is often preferred when through-hole and
Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not
suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high
densities that come with increased miniaturization.
12.2 Wave and reflow soldering
Wave soldering is a joining technology in which the joints are made by solder coming from
a standing wave of liquid solder. The wave soldering process is suitable for the following:
Through-hole components
Leaded or leadless SMDs, which are glued to the surface of the printed circuit board
Not all SMDs can be wave soldered. Packages with solder balls, and some leadless
packages which have solder lands underneath the body, cannot be wave soldered. Also,
leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,
due to an increased probability of bridging.
The reflow soldering process involves applying solder paste to a board, followed by
component placement and exposure to a temperature profile. Leaded packages,
packages with solder balls, and leadless packages are all reflow solderable.
Key characteristics in both wave and reflow soldering are:
Board specifications, including the board finish, solder masks and vias
Package footprints, including solder thieves and orientation
The moisture sensitivity level of the packages
Package placement
Inspection and repair
Lead-free soldering versus SnPb soldering
12.3 Wave soldering
Key characteristics in wave soldering are:
Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
Solder bath specifications, including temperature and impurities
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| SC16C852VIBS-G | 功能描述:UART 接口集成電路 1.8V 2CH UART 128B FIFO 5MBPS RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 數(shù)據(jù)速率:3 Mbps 電源電壓-最大:3.6 V 電源電壓-最小:2.7 V 電源電流:20 mA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:LQFP-48 封裝:Reel |
| SC16C852VIBS-S | 功能描述:UART 接口集成電路 1.8V 2CH UART 128B FIFO 5MBPS RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 數(shù)據(jù)速率:3 Mbps 電源電壓-最大:3.6 V 電源電壓-最小:2.7 V 電源電流:20 mA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:LQFP-48 封裝:Reel |
| SC16C852VIET | 功能描述:UART 接口集成電路 1.8V 2CH UART 128B FIFO 5MBPS RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 數(shù)據(jù)速率:3 Mbps 電源電壓-最大:3.6 V 電源電壓-最小:2.7 V 電源電流:20 mA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:LQFP-48 封裝:Reel |
| SC16C852VIET,115 | 功能描述:UART 接口集成電路 1.8V 2CH UART 128B RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 數(shù)據(jù)速率:3 Mbps 電源電壓-最大:3.6 V 電源電壓-最小:2.7 V 電源電流:20 mA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:LQFP-48 封裝:Reel |
| SC16C852VIET,118 | 功能描述:UART 接口集成電路 UART 2-CH 128Byte FIFO 1.8V 36-Pin RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 數(shù)據(jù)速率:3 Mbps 電源電壓-最大:3.6 V 電源電壓-最小:2.7 V 電源電流:20 mA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:LQFP-48 封裝:Reel |
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