參數(shù)資料
型號(hào): SIGC54T60R3
廠商: INFINEON TECHNOLOGIES AG
英文描述: IGBT-3 Chip
中文描述: IGBT的- 3芯片
文件頁(yè)數(shù): 1/4頁(yè)
文件大?。?/td> 91K
代理商: SIGC54T60R3
SIGC54T60R3
Edited by INFINEON Technologies AI PS DD CLS, L7581A, Edition 1, 09.06.2004
IGBT
3
Chip
FEATURES:
600V Trench & Field Stop technology
low V
CE(sat)
low turn-off losses
short tail current
positive temperature coefficient
easy paralleling
Chip Type
This chip is used for:
power module
Applications:
drives
G
C
E
V
CE
I
Cn
Die Size
Package
Ordering Code
Q67050-
A4341-A101
SIGC54T60R3
600V
100A
5.97 x 8.97 mm
2
sawn on foil
MECHANICAL PARAMETER:
Raster size
5.97 x 8.97
( 2.489 x 1.767 ) x 4
( 2.789 x 1.995 ) x 4
Emitter pad size
Gate pad size
1.615 x 0.817
mm
2
Area total / active
53.6 / 40
mm
2
Thickness
70
μm
Wafer size
150
mm
Flat position
90
deg
Max. possible chips per wafer
245 pcs
Passivation frontside
Photoimide
Emitter metallization
3200 nm AlSiCu
Collector metallization
1400 nm Ni Ag –system
suitable for epoxy and soft solder die bonding
Die bond
electrically conductive glue or solder
Wire bond
Al, <500μm
Reject ink dot size
0.65mm ; max 1.2mm
Recommended storage environment
store in original container, in dry nitrogen,
< 6 month at an ambient temperature of 23°C
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