(TA = +25°C unless otherwise noted)
參數(shù)資料
型號(hào): SMP04ESZ-REEL
廠商: Analog Devices Inc
文件頁(yè)數(shù): 9/15頁(yè)
文件大?。?/td> 0K
描述: IC AMP SAMPLE HOLD CMOS 16SOIC
標(biāo)準(zhǔn)包裝: 2,500
放大器類型: 采樣和保持
電路數(shù): 4
轉(zhuǎn)換速率: 4 V/µs
電流 - 輸入偏壓: 500nA
電壓 - 輸入偏移: 2500µV
電流 - 電源: 4mA
電流 - 輸出 / 通道: 1.2mA
電壓 - 電源,單路/雙路(±): 5 V ~ 12 V,±2.5 V ~ 6 V
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 16-SOIC(0.154",3.90mm 寬)
供應(yīng)商設(shè)備封裝: 16-SOIC
包裝: 帶卷 (TR)
SMP04
–3–
REV. D
ABSOLUTE MAXIMUM RATINGS
(TA = +25°C unless otherwise noted)
VDD to DGND . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V, 17 V
VDD to VSS
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.7 V, 17 V
VLOGIC to DGND . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V, VDD
VIN to DGND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VSS, VDD
VOUT to DGND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VSS, VDD
Analog Output Current . . . . . . . . . . . . . . . . . . . . . . .
±20 mA
(Not Short-Circuit Protected)
Digital Input Voltage to DGND . . . . . . . –0.3 V, VDD + 0.3 V
Operating Temperature Range
EQ, EP, ES . . . . . . . . . . . . . . . . . . . . . . . . –40
°C to +85°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . +150
°C
Storage Temperature . . . . . . . . . . . . . . . . . . –65
°C to +150°C
Lead Temperature (Soldering, 60 sec) . . . . . . . . . . . . +300
°C
Package Type
JA*
JC
Units
16-Lead Cerdip
94
12
°C/W
16-Lead Plastic DIP
76
33
°C/W
16-Lead SO
92
27
°C/W
* JA is specified for worst case mounting conditions, i.e., JA is specified for device
in socket for cerdip and plastic DIP packages; JA is specified for device soldered
to printed circuit board for SO package.
CAUTION
1. Stresses above those listed under Absolute Maximum Ratings may cause
permanent damage to the device. This is a stress rating only; function operation
at or above this specification is not implied. Exposure to the above maximum
rating conditions for extended periods may affect device reliability.
2. Digital inputs and outputs are protected; however, permanent damage may
occur on unprotected units from high energy electrostatic fields. Keep units in
conductive foam or packaging at all times until ready to use. Use proper antistatic
handling procedures.
3. Remove power before inserting or removing units from their sockets.
ORDERING GUIDE
Temperature
Package
Model
Range
Description
Options*
SMP04EQ
–40
°C to +85°C
Cerdip-16
Q-16
SMP04EP
–40
°C to +85°C
PDIP-16
N-16
SMP04ES
–40
°C to +85°C
SO-16
R-16A
*Q = Cerdip; N = Plastic DIP; R = Small Outline.
PIN CONNECTIONS
16-Lead Cerdip
16-Lead Plastic DIP
16-Lead SO
14
13
12
11
16
15
10
9
8
1
2
3
4
7
6
5
TOP VIEW
(Not to Scale)
SMP04
NC = NO CONNECT
VOUT2
VSS
VOUT4
VOUT3
VDD
VOUT1
VIN1
NC
S/H4
VIN3
VIN4
VIN2
S/H1
S/H2
DGND
S/H3
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the SMP04 features proprietary ESD protection circuitry, permanent damage may
occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
WARNING!
ESD SENSITIVE DEVICE
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