PACKAGING INFORMATION
Orderable Device
Status
(1)
Package
Type
SOT-23
Package
Drawing
DBV
Pins Package
Qty
3000 Green (RoHS &
no Sb/Br)
3000 Green (RoHS &
no Sb/Br)
250
Green (RoHS &
no Sb/Br)
3000 Green (RoHS &
no Sb/Br)
3000 Green (RoHS &
no Sb/Br)
250
Green (RoHS &
no Sb/Br)
4000 Green (RoHS &
no Sb/Br)
3000 Green (RoHS &
no Sb/Br)
250
Green (RoHS &
no Sb/Br)
3000 Green (RoHS &
no Sb/Br)
250
Green (RoHS &
no Sb/Br)
4000 Green (RoHS &
no Sb/Br)
3000 Green (RoHS &
no Sb/Br)
3000 Green (RoHS &
no Sb/Br)
3000 Green (RoHS &
no Sb/Br)
Eco Plan
(2)
Lead/Ball Finish
MSL Peak Temp
(3)
74LVC1GU04DBVRE4
ACTIVE
5
CU NIPDAU
Level-1-260C-UNLIM
74LVC1GU04DBVRG4
ACTIVE
SOT-23
DBV
5
CU NIPDAU
Level-1-260C-UNLIM
74LVC1GU04DBVTE4
ACTIVE
SOT-23
DBV
5
CU NIPDAU
Level-1-260C-UNLIM
74LVC1GU04DCKRE4
ACTIVE
SC70
DCK
5
CU NIPDAU
Level-1-260C-UNLIM
74LVC1GU04DCKRG4
ACTIVE
SC70
DCK
5
CU NIPDAU
Level-1-260C-UNLIM
74LVC1GU04DCKTE4
ACTIVE
SC70
DCK
5
CU NIPDAU
Level-1-260C-UNLIM
74LVC1GU04DRLRG4
ACTIVE
SOT-533
DRL
5
CU NIPDAU
Level-1-260C-UNLIM
SN74LVC1GU04DBVR
ACTIVE
SOT-23
DBV
5
CU NIPDAU
Level-1-260C-UNLIM
SN74LVC1GU04DBVT
ACTIVE
SOT-23
DBV
5
CU NIPDAU
Level-1-260C-UNLIM
SN74LVC1GU04DCKR
ACTIVE
SC70
DCK
5
CU NIPDAU
Level-1-260C-UNLIM
SN74LVC1GU04DCKT
ACTIVE
SC70
DCK
5
CU NIPDAU
Level-1-260C-UNLIM
SN74LVC1GU04DRLR
ACTIVE
SOT-533
DRL
5
CU NIPDAU
Level-1-260C-UNLIM
SN74LVC1GU04YZPR
ACTIVE
WCSP
YZP
5
SNAGCU
Level-1-260C-UNLIM
SN74LVC1GU04YZTR
ACTIVE
DSBGA
YZT
4
SNAGCU
Level-1-260C-UNLIM
SN74LVC1GU04YZVR
ACTIVE
DSBGA
YZV
4
SNAGCU
Level-1-260C-UNLIM
(1)
The marketing status values are defined as follows:
ACTIVE:
Product device recommended for new designs.
LIFEBUY:
TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND:
Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW:
Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE:
TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent
for the latest availability information and additional product content details.
TBD:
The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS):
TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt):
This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br):
TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
PACKAGE OPTION ADDENDUM
www.ti.com
6-Feb-2007
Addendum-Page 1