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參數(shù)資料
| 型號： | SNJ54AC241FK |
| 廠商： | Texas Instruments, Inc. |
| 英文描述： | OCTAL BUFFERS/DRIVERS WITH 3-STATE OUTPUTS |
| 中文描述： | 八路緩沖器/ 3司機(jī)態(tài)輸出 |
| 文件頁數(shù)： | 6/13頁 |
| 文件大小： | 378K |
| 代理商： | SNJ54AC241FK |
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package
Type
SSOP
SSOP
Package
Drawing
DB
DB
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish
MSL Peak Temp
(3)
SN74AC241DBLE
SN74AC241DBR
OBSOLETE
ACTIVE
20
20
TBD
Call TI
CU NIPDAU
Call TI
Level-1-260C-UNLIM
2000 Green (RoHS &
no Sb/Br)
2000 Green (RoHS &
no Sb/Br)
25
Green (RoHS &
no Sb/Br)
25
Green (RoHS &
no Sb/Br)
2000 Green (RoHS &
no Sb/Br)
2000 Green (RoHS &
no Sb/Br)
20
Pb-Free
(RoHS)
20
Pb-Free
(RoHS)
2000 Green (RoHS &
no Sb/Br)
2000 Green (RoHS &
no Sb/Br)
70
Green (RoHS &
no Sb/Br)
70
Green (RoHS &
no Sb/Br)
SN74AC241DBRE4
ACTIVE
SSOP
DB
20
CU NIPDAU
Level-1-260C-UNLIM
SN74AC241DW
ACTIVE
SOIC
DW
20
CU NIPDAU
Level-1-260C-UNLIM
SN74AC241DWE4
ACTIVE
SOIC
DW
20
CU NIPDAU
Level-1-260C-UNLIM
SN74AC241DWR
ACTIVE
SOIC
DW
20
CU NIPDAU
Level-1-260C-UNLIM
SN74AC241DWRE4
ACTIVE
SOIC
DW
20
CU NIPDAU
Level-1-260C-UNLIM
SN74AC241N
ACTIVE
PDIP
N
20
CU NIPDAU
N / A for Pkg Type
SN74AC241NE4
ACTIVE
PDIP
N
20
CU NIPDAU
N / A for Pkg Type
SN74AC241NSR
ACTIVE
SO
NS
20
CU NIPDAU
Level-1-260C-UNLIM
SN74AC241NSRE4
ACTIVE
SO
NS
20
CU NIPDAU
Level-1-260C-UNLIM
SN74AC241PW
ACTIVE
TSSOP
PW
20
CU NIPDAU
Level-1-260C-UNLIM
SN74AC241PWE4
ACTIVE
TSSOP
PW
20
CU NIPDAU
Level-1-260C-UNLIM
SN74AC241PWLE
SN74AC241PWR
OBSOLETE
ACTIVE
TSSOP
TSSOP
PW
PW
20
20
TBD
Call TI
CU NIPDAU
Call TI
Level-1-260C-UNLIM
2000 Green (RoHS &
no Sb/Br)
2000 Green (RoHS &
no Sb/Br)
SN74AC241PWRE4
ACTIVE
TSSOP
PW
20
CU NIPDAU
Level-1-260C-UNLIM
(1)
The marketing status values are defined as follows:
ACTIVE:
Product device recommended for new designs.
LIFEBUY:
TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND:
Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW:
Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE:
TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent
for the latest availability information and additional product content details.
TBD:
The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS):
TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt):
This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br):
TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
PACKAGE OPTION ADDENDUM
www.ti.com
18-Jul-2006
Addendum-Page 1
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