參數(shù)資料
型號: SPC5607BF1MLU6
廠商: Freescale Semiconductor
文件頁數(shù): 65/112頁
文件大?。?/td> 0K
描述: IC MCU 32BIT 1.5MB FLASH 176LQFP
標(biāo)準(zhǔn)包裝: 200
系列: MPC56xx Qorivva
核心處理器: e200z0h
芯體尺寸: 32-位
速度: 64MHz
連通性: CAN,I²C,LIN,SCI,SPI
外圍設(shè)備: DMA,POR,PWM,WDT
輸入/輸出數(shù): 149
程序存儲器容量: 1.5MB(1.5M x 8)
程序存儲器類型: 閃存
RAM 容量: 96K x 8
電壓 - 電源 (Vcc/Vdd): 3 V ~ 5.5 V
數(shù)據(jù)轉(zhuǎn)換器: A/D 29x10b,5x12b
振蕩器型: 內(nèi)部
工作溫度: -40°C ~ 125°C
封裝/外殼: 176-LQFP
包裝: 托盤
MPC5607B Microcontroller Data Sheet, Rev. 7
Electrical characteristics
Freescale Semiconductor
56
4.8
Power management electrical characteristics
4.8.1
Voltage regulator electrical characteristics
The device implements an internal voltage regulator to generate the low voltage core supply VDD_LV from the high voltage
ballast supply VDD_BV. The regulator itself is supplied by the common I/O supply VDD. The following supplies are involved:
HV: High voltage external power supply for voltage regulator module. This must be provided externally through VDD
power pin.
BV: High voltage external power supply for internal ballast module. This must be provided externally through VDD_BV
power pin. Voltage values should be aligned with VDD.
LV: Low voltage internal power supply for core, FMPLL and Flash digital logic. This is generated by the internal voltage
regulator but provided outside to connect stability capacitor. It is further split into four main domains to ensure noise
isolation between critical LV modules within the device:
— LV_COR: Low voltage supply for the core. It is also used to provide supply for FMPLL through double bonding.
— LV_CFLA: Low voltage supply for code flash module. It is supplied with dedicated ballast and shorted to LV_COR
through double bonding.
— LV_DFLA: Low voltage supply for data flash module. It is supplied with dedicated ballast and shorted to LV_COR
through double bonding.
— LV_PLL: Low voltage supply for FMPLL. It is shorted to LV_COR through double bonding.
Figure 9. Voltage regulator capacitance connection
The internal voltage regulator requires external capacitance (CREGn) to be connected to the device in order to provide a stable
low voltage digital supply to the device. Capacitances should be placed on the board as near as possible to the associated pins.
Care should also be taken to limit the serial inductance of the board to less than 5 nH.
C
REG
1
(L
V_COR/L
V
_DF
L
A)
DEVICE
VSS_LV
VDD_BV
VDD_LV
C
DE
C
1
(B
alla
st
decoup
ling)
VSS_LV
VDD_LV
VDD
VSS_LV
VDD_LV
CREG2 (LV_COR/LV_CFLA)
CREG3
CDEC2
DEVICE
VDD_BV
I
VDD_LVn
VREF
VDD
Voltage Regulator
VSS
VSS_LVn
(supply/IO decoupling)
(LV_COR/LV_PLL)
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