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參數(shù)資料
| 型號(hào)： | STPC0380BTI3 |
| 廠(chǎng)商： | 意法半導(dǎo)體 |
| 英文描述： | PC Compatible Embeded Microprocessor |
| 中文描述： | PC兼容嵌入式微處理器 |
| 文件頁(yè)數(shù)： | 43/51頁(yè) |
| 文件大小： | 726K |
| 代理商： | STPC0380BTI3 |
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BOARD LAYOUT
43/51
Issue 1.2
6. BOARD LAYOUT
6.1 THERMAL DISSIPATION
Thermal dissipation of the STPC depends mainly
on supply voltage. As a result, when the system
does not need to workat 3.3V, it may be to reduce
the voltage to 3.15V for example. This may save
few 100’s of mW.
The second area that can be concidered is un-
used interfaces and functions. Depending on the
application, some input signals can be grounded,
and some blocks not powered or shutdown. Clock
speed dynamic adjustment is also a solution that
can be usedalong with the integrated power man-
agement unit.
The standard way to route thermalballs to internal
ground layerimplements only one viapad for each
ball pad, connected using a 8-mil wire.
With such configuration the Plastic BGA 388 pack-
age dissipates 90%of the heat through theground
balls, and especially the central thermal balls
which are directly connected to the die, the re-
maining 10% is dissipated through the case. Add-
ing a heat sink reduces this value to 85%.
As a result, some basic rules have to be applied
when routing the STPC in order to avoid thermal
problems.
First of all, the whole ground layer acts as a heat
sink and ground balls must be directly connected
to it as illustrated in Figure 6-1.
If one ground layer is not enough, a second
ground plane may be added on the solder side.
Figure 6-1. Ground routing
Pad for ground ball
Thru hole to ground layer
TopLayer:Sgnas
Powerlayer
BotomLayer:sgnas+locagroundlayer(fneeded
Goundlayer
Note: For better visibility, ground balls are not all routed.
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