參數(shù)資料
型號: STPCC0166BTI3
廠商: STMICROELECTRONICS
元件分類: 外設(shè)及接口
英文描述: MULTIFUNCTION PERIPHERAL, PBGA388
封裝: PLASTIC, BGA-388
文件頁數(shù): 55/71頁
文件大?。?/td> 1238K
代理商: STPCC0166BTI3
Obsolete
Product(s)
- Obsolete
Product(s)
DESIGN GUIDELINES
Issue 2.4 - November 8, 2001
59/71
Figure 6-5 describes a complete implementation
of the external glue logic for DMA Request time-
multiplexing and DMA Acknowledge demultiplex-
ing. Like for the interrupt lines, this logic can be
simplified when only few DMA channels are used
in the application.
This glue logic is not needed in Local bus mode as
it does not support DMA transfers.
Figure 6-5. Typical DMA multiplexing and demultiplexing
74x153
1C0
1Y
1G
DRQ[0]
DREQ_MUX[0]
1C1
1C2
1C3
2C0
2C1
2C2
2C3
A
B
2G
2Y
DREQ_MUX[1]
DRQ[1]
DRQ[2]
DRQ[3]
DRQ[4]
DRQ[5]
DRQ[6]
DRQ[7]
74x138
Y0#
A
G2B
DACK0#
Y1#
Y2#
Y3#
Y4#
Y5#
Y6#
Y7#
C
B
G2A
ISA_CLK2X
ISA_CLK
ISA, Refresh
ISA, PIO
ISA, FDC
ISA, PIO
Slave DMAC
ISA
G1
DMA_ENC[0]
DMA_ENC[1]
DMA_ENC[2]
DACK1#
DACK2#
DACK3#
DACK5#
DACK6#
DACK7#
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