參數(shù)資料
型號(hào): SY89531LHZ
廠商: MICREL INC
元件分類: 時(shí)鐘產(chǎn)生/分配
英文描述: 622.08 MHz, OTHER CLOCK GENERATOR, PQFP64
封裝: LEAD FREE, TQFP-64
文件頁數(shù): 11/16頁
文件大?。?/td> 105K
代理商: SY89531LHZ
4
Precision Edge
SY89531L
Micrel, Inc.
M9999-010808
hbwhelp@micrel.com or (408) 955-1690
Absolute Maximum Ratings(Note 1)
Supply Voltage (V
IN) ................................... –0.5V to +4.0V
V
CC Pin Potential to Ground Pin (All VCC).. –0.5V to +4.0V
Input Voltage (except XTAL 1,2 pins) (V
IN) ... –0.5V to VCCI
XTAL 1, 2 Input Voltage (V
XTAL 1,2) ...... (VCC–1.9V) to VCC
DC Output Current (I
OUT)
–LVPECL, HSTL outputs ..................................... –50mA
Lead Temperature (soldering, 20 sec.) ..................... 260
°C
Storage Temperature (T
S) ....................... –65°C to +150°C
Operating Ratings(Note 2)
Supply Voltage
V
CCOA and VCCOC ...................................... 3.0V to 3.6V
V
CCOB ......................................................... 1.6V to 2.0V
Ambient Temperature (T
A) ............................. 0°C to +85°C
Package Thermal Resistance (Junction-to-Ambient)
With Die attach soldered to GND:
TQFP (
θ
JA) Still-Air .............................................. 23°C/W
TQFP (
θ
JA) 200lfpm ............................................ 18°C/W
TQFP (
θ
JA) 500lfpm ............................................ 15°C/W
With Die attach NOT soldered to GND, Note 3
TQFP (
θ
JA) Still-Air .............................................. 44°C/W
TQFP (
θ
JA) 200lfpm ............................................ 36°C/W
TQFP (
θ
JA) 500lfpm ............................................ 30°C/W
Package Thermal Resistance (Junction-to-Case)
TQFP
JC) ......................................................... 4.3°C/W
Power Supply
Symbol
Parameter
Condition
Min
Typ
Max
Units
V
CCA
PLL and Logic Supply Voltage
Note 4
3.0
3.3
3.6
V
CC_Logic
V
CCOA/C
Bank A and C V
CC Output
3.0
3.3
3.6
V
CCOB
Bank B V
CC Output
LVPECL/HSTL
1.6
1.8
2.0
V
I
CC
Total Supply Current
Note 5
230
295
mA
DC ELECTRICAL CHARACTERISTICS
Note 1.
Permanent device damage may occur if absolute maximum ratings are exceeded. This is a stress rating only and functional operation is not implied
at conditions other than those detailed in the operational sections of this data sheet. Exposure to absolute maximum ratlng conditions for extended
periods may affect device reliability.
Note 2.
The data sheet limits are not guaranteed if the device is operated beyond the operating ratings.
Note 3.
It is recommended that the user always solder the exposed die pad to a ground plane for enhanced heat dissipation.
Note 4.
V
CCA, VCC_LOGIC, VCCOA/C are not internally connected together inside the device. They must be connected together on the PCB. VCCOB is a
separate supply.
Note 5.
No load. Outputs floating, Banks A, B, and C enabled.
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