Precision Edge SY89823L Micrel, Inc. M9999-091908 hbwhelp@micrel.com or (408) 955-1690
參數(shù)資料
型號: SY89823LHG
廠商: Micrel Inc
文件頁數(shù): 3/8頁
文件大?。?/td> 0K
描述: IC CLK BUF MUX TRNSL 2:22 64TQFP
標(biāo)準(zhǔn)包裝: 160
系列: Precision Edge®
類型: 扇出緩沖器(分配),多路復(fù)用器,變換器
電路數(shù): 1
比率 - 輸入:輸出: 2:22
差分 - 輸入:輸出: 是/是
輸入: HSTL,LVPECL
輸出: HSTL
頻率 - 最大: 500MHz
電源電壓: 3.15 V ~ 3.45 V
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 64-TQFP 裸露焊盤
供應(yīng)商設(shè)備封裝: 64-EP-TQFP
包裝: 托盤
其它名稱: 576-1429
3
Precision Edge
SY89823L
Micrel, Inc.
M9999-091908
hbwhelp@micrel.com or (408) 955-1690
DC ELECTRICAL CHARACTERISTICS(4)
Absolute Maximum Ratings(1)
Supply Voltage (V
IN) ..................................... –0.5V to VCCI
VCC Pin Potential to Ground Pin
V
CCI, VCCO ........................................................... –0.5V to +4.0V
DC Output Current, Output HIGH (I
OUT) .................. –50mA
Lead Temperature (soldering, 20 sec.) ..................... 260
°C
Storage Temperature (T
S) ....................... –65°C to +150°C
Operating Ratings(2)
Supply Voltage
V
CCI .................................................................. +3.15V to +3.45V
V
CCO ..................................................................... +1.6V to +2.0V
Ambient Temperature (T
A) ......................... –40°C to +85°C
Package Thermal Resistance(3)
EPAD-TQFP
JA) with Die attach soldered to GND
Still-Air ............................................................. 23
°C/W
200lfpm ............................................................ 18
°C/W
500lfpm ............................................................ 15
°C/W
with Die attach NOT soldered to GND
Still-Air ............................................................. 44
°C/W
200lfpm ............................................................ 36
°C/W
500lfpm ............................................................ 30
°C/W
EPAD-TQFP
JC) .............................................. 4.3°C/W
Power Supply T
A = –40°C to +85°C, unless otherwise stated.
Symbol
Parameter
Condition
Min
Typ
Max
Units
V
CCI
V
CC Core
3.15
3.3
3.45
V
CCO
V
CC Output
1.6
1.8
2.0
V
I
CCI
I
CC Core
Max V
CC, no load
115
170
mA
HSTL V
CCI = 3.3V ± 5%; VCCO = 1.8V ± 10%; RL = 50 to GND; TA = –40°C to +85°C, unless otherwise stated.
Symbol
Parameter
Condition
Min
Typ
Max
Units
V
OH
Output HIGH Voltage
1.0
1.2
V
OL
Output LOW Voltage
0.2
0.4
V
IH
Input HIGH Voltage
V
X +0.1
1.6
V
IL
Input LOW Voltage
–0.3
V
X –0.1
V
X
Input Crossover Voltage
0.68
0.9
V
I
IH
Input HIGH Current
+20
—–350
A
I
IL
Input LOW Current
——
–500
A
LVPECL V
CCI = 3.3V ± 5%; VCCO = 1.8V ± 10%; TA = –40°C to +85°C, unless otherwise stated.
Symbol
Parameter
Condition
Min
Max
Units
V
IH
Input HIGH Voltage
V
CCI – 1.165 VCCI – 0.880
V
IL
Input LOW Voltage
V
CCI – 1.810 VCCI – 1.475
V
I
IH
Input HIGH Current
+150
A
I
IL
Input LOW Current
0.5
A
Notes:
1. Permanent device damage may occur if the ratings in the “Absolute Maximum Ratings” section are exceeded. This is a stress rating only and
functional operation is not implied at conditions other than those detailed in the operational sections of this data sheet. Exposure to absolute
maximum ratings conditions for extended periods may affect device reliability.
2. The data sheet limits are not guaranteed if the device is operated beyond the operating ratings.
3. Valid for 4-layer board.
4. The circuit is designed to meet the DC specifications shown in the above table after thermal equilibrium has been established.
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