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參數(shù)資料
| 型號(hào)： | TA1101B |
| 廠(chǎng)商： | Electronic Theatre Controls, Inc. |
| 元件分類(lèi)： | 運(yùn)動(dòng)控制電子 |
| 英文描述： | Stereo 10W (4з) Class-T⑩ Digital Audio Amplifier using Digital Power Processing⑩ Technology |
| 中文描述： | 10W的立體聲（4з）類(lèi)- T的數(shù)字音頻放大器⑩使用數(shù)字電源技術(shù)處理⑩ |
| 文件頁(yè)數(shù)： | 10/13頁(yè) |
| 文件大小： | 202K |
| 代理商： | TA1101B |
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T E C H N I C A L I N F O R M A T I O N
10
TA1101B, Rev. 2.2, 08.17.00
Sleep Pin
The SLEEP pin is a 5V logic input that when pulled high (>3.5V) puts the part into a low quiescent current
mode. This pin is internally clamped by a zener diode to approximately 6V thus allowing the pin to be
pulled up through a large valued resistor (1M
recommended) to V
DD
. To disable SLEEP mode, the sleep
pin should be grounded.
Fault Pin
The FAULT pin is a 5V logic output that indicates various fault conditions within the device. These
conditions include: low supply voltage, low charge pump voltage, low 5V regulator voltage, over current at
any output, and junction temperature greater than approximately 155
°
C. All faults except overcurrent all
reset upon removal of the condition. The FAULT output is capable of directly driving an LED through a
series 200
resistor. If the FAULT pin is connected directly to the MUTE input an automatic reset will
occur in the event of an over-current condition.
Power Dissipation Derating
For operating at ambient temperatures above 25
°
C the device must be derated based on a 150
°
C
maximum junction temperature, T
JMAX
as given by the following equation:
JA
A
JMAX
T
DISS
P
)
T
(
θ
=
Where
θ
JA
of the package is determined from the following graph:
In the above graph Copper Area is the size of the copper pad on the PC board to which the heat slug of
the TA1101B is soldered. The heat slug must be soldered to the PCB to increase the maximum power
dissipation capability of the TA1101B package. Soldering will minimize the likelihood of an over-
temperature fault occurring during continuous heavy load conditions. The vias used for connecting the
heatslug to the copper area on the PCB should be 0.013” diameter.
Θ
JA
vs Copper Area
10
20
30
40
50
0
1
2
3
4
5
6
Copper Area (square inches)
J
o
C
Pdiss - 1.35W
Pdiss - 2W
Pdiss - 3.4W
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