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參數(shù)資料
| 型號： | TAS5110ADAP |
| 廠商： | TEXAS INSTRUMENTS INC |
| 元件分類： | 音頻／視頻放大 |
| 英文描述： | 50 W, 2 CHANNEL, AUDIO AMPLIFIER, PDSO32 |
| 封裝： | POWERPAD, PLASTIC, HTSSOP-32 |
| 文件頁數(shù)： | 6/20頁 |
| 文件大?。?/td> | 290K |
| 代理商： | TAS5110ADAP |
TAS5110A
SLES079 – APRIL 2003
14
www.ti.com
THERMAL INFORMATION
The thermally enhanced DAP package is based on the 32-pin HTSSOP, but includes a thermal pad (see
Figure 6) to provide an effective thermal contact between the IC and the PCB.
Traditionally, surface mount and power have been mutually exclusive terms. A variety of scaled-down TO-220
type packages have leads formed as gull wings to make them applicable for surface-mount applications. These
packages, however, have two shortcomings: they do not address the low profile requirements (<2 mm) of many
of today’s advanced systems, and they do not offer a terminal count that is high enough to accommodate
increasing integration. On the other hand, traditional low-power surface-mount packages require
power-dissipation derating that severely limits the usable range of many high-performance analog circuits.
The PowerPAD package (thermally enhanced HTSSOP) combines fine-pitch surface-mount technology with
thermal performance comparable to much larger power packages.
The PowerPAD package is designed to optimize the heat transfer to the PCB. Because of the very small size
and limited mass of a HTSSOP package, thermal enhancement is achieved by improving the thermal
conduction paths that remove heat from the component. The thermal pad is formed using a patented lead-frame
design and manufacturing technique to provide a direct connection to the heat-generating IC. When this pad
is soldered or otherwise thermally coupled to an external heat dissipater, high power dissipation in the ultrathin,
fine-pitch, surface-mount package can be reliably achieved. See the dissipation derating table.
DIE
Thermal
Pad
End View DAP
Bottom View DAP
DIE
End View DAD
Thermal
Pad
Top View DAD
DAP Package
DAD Package
Figure 6. Views of Thermally Enhanced DAP Package
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| TAS5110DAD | 功能描述:音頻放大器 Dig Amp Power Stage RoHS:否 制造商:STMicroelectronics 產(chǎn)品:General Purpose Audio Amplifiers 輸出類型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel |
| TAS5110DADG4 | 功能描述:音頻放大器 Dig Amp Power Stage RoHS:否 制造商:STMicroelectronics 產(chǎn)品:General Purpose Audio Amplifiers 輸出類型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel |
| TAS5110DADR | 功能描述:音頻放大器 Dig Amp Power Stage RoHS:否 制造商:STMicroelectronics 產(chǎn)品:General Purpose Audio Amplifiers 輸出類型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel |
| TAS5110DADRG4 | 功能描述:音頻放大器 Dig Amp Power Stage RoHS:否 制造商:STMicroelectronics 產(chǎn)品:General Purpose Audio Amplifiers 輸出類型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel |
| TAS5110DAP | 功能描述:音頻放大器 Dig Amp Power Stage RoHS:否 制造商:STMicroelectronics 產(chǎn)品:General Purpose Audio Amplifiers 輸出類型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel |
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