參數(shù)資料
型號(hào)： TAS5110ADAP
廠商： TEXAS INSTRUMENTS INC
元件分類(lèi)： 音頻／視頻放大
英文描述： 50 W, 2 CHANNEL, AUDIO AMPLIFIER, PDSO32
封裝： POWERPAD, PLASTIC, HTSSOP-32
文件頁(yè)數(shù)： 7/20頁(yè)
文件大小： 290K
代理商： TAS5110ADAP
TAS5110A
SLES079 – APRIL 2003
15
www.ti.com
Thermal Methodology for the 32-Pin DAD Package 50 W, 6-
Test
The thermal test for the DAD part (e.g., thermal pad oriented away from the board) was conducted as shown
in Figure 7 and Figure 8. The cooling approach was to attach a heat sink to the thermal pad and conduct the
heat to ambient air.
Since the approach was to use a chassis below the board, it was inverted and a spacer bar used to connect
the pads thermally to the heat sink. The bar was made high enough that the components on the board were
clear of the chassis.
The pad-to-spacer thermal resistance was about 3.2
_C/W with the thermal compound indicated.
The chassis provided the only heat sink to air and was chosen as representative of a possible cooling approach.
A closed plastic top and insulating front and back panels ensured that only the bottom and sides of the U shaped
chassis contributed to cooling. The chassis was spaced 0.25 inch from the table to simulate a normal chassis
configuration. The thermal pad does not need to be isolated from ground. (Any heat sink with a thermal
resistance to air of 3.9
_C/W or lower also works.) In this test, the exposed chassis reached long-term equilibrium
temperatures above 50
_C, so the approach would have to be modified for touch temperature consideration. The
chassis temperature after 10 minutes of 50 W into 6
was below 50_C.
The test ran for three hours with 2
× 50 W RMS at 1 kHz into a 6- resistive load at an ambient lab temperature
of 23
_C. No audio or thermal problems were encountered during that time.
32 DAD Package
Wakefield Type 126
Thermal Compound
(3.2
°C/W)
Stereo Amplifier Board
Wakefield Type 126
Thermal Compound
(0.169
°C/W)
1.25 in.
Insulating
Back Panel
Insulating
Front Panel
Plastic Top Cover
Aluminum Space Bar
(1/4 in. Thick)
(2.44
°C/W)
Aluminum Chassis 7.2 in.
× 1 in. × 0.1 in. Thick.
Sides of U-Shaped Chassis Are 1.25 in. High
(3.9
°C/W).
Figure 7. 32-Pin DAD Package Cross-Sectional View (Side)
相關(guān)PDF資料
PDF描述
TAS5110DADG4 50 W, 2 CHANNEL, AUDIO AMPLIFIER, PDSO32
TAS5110DAPRG4 50 W, 2 CHANNEL, AUDIO AMPLIFIER, PDSO32
TAS5110DAD 50 W, 2 CHANNEL, AUDIO AMPLIFIER, PDSO32
TAS5110DAP 50 W, 2 CHANNEL, AUDIO AMPLIFIER, PDSO32
TAS5110IDAP 50 W, 2 CHANNEL, AUDIO AMPLIFIER, PDSO32
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
TAS5110DAD 功能描述:音頻放大器 Dig Amp Power Stage RoHS:否 制造商:STMicroelectronics 產(chǎn)品:General Purpose Audio Amplifiers 輸出類(lèi)型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel
TAS5110DADG4 功能描述:音頻放大器 Dig Amp Power Stage RoHS:否 制造商:STMicroelectronics 產(chǎn)品:General Purpose Audio Amplifiers 輸出類(lèi)型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel
TAS5110DADR 功能描述:音頻放大器 Dig Amp Power Stage RoHS:否 制造商:STMicroelectronics 產(chǎn)品:General Purpose Audio Amplifiers 輸出類(lèi)型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel
TAS5110DADRG4 功能描述:音頻放大器 Dig Amp Power Stage RoHS:否 制造商:STMicroelectronics 產(chǎn)品:General Purpose Audio Amplifiers 輸出類(lèi)型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel
TAS5110DAP 功能描述:音頻放大器 Dig Amp Power Stage RoHS:否 制造商:STMicroelectronics 產(chǎn)品:General Purpose Audio Amplifiers 輸出類(lèi)型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel
發(fā)布緊急采購(gòu)，3分鐘左右您將得到回復(fù)。

采購(gòu)需求

(若只采購(gòu)一條型號(hào)，填寫(xiě)一行即可)

發(fā)布成功！您可以繼續(xù)發(fā)布采購(gòu)。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

發(fā)布成功！您可以繼續(xù)發(fā)布采購(gòu)。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

*型號(hào) *數(shù)量 廠商 批號(hào) 封裝
添加更多采購(gòu)

我的聯(lián)系方式

*
*
*