參數(shù)資料
型號(hào): TC534CKW
廠商: Microchip Technology
文件頁數(shù): 13/28頁
文件大?。?/td> 0K
描述: IC DATA ACQ SUBSYSTEM 44-MQFP
標(biāo)準(zhǔn)包裝: 96
類型: 數(shù)據(jù)采集系統(tǒng)(DAS)
分辨率(位): 17 b
采樣率(每秒): 6.5
數(shù)據(jù)接口: 串行
電壓電源: 單電源
電源電壓: 4.5 V ~ 5.5 V
工作溫度: 0°C ~ 70°C
安裝類型: 表面貼裝
封裝/外殼: 44-QFP
供應(yīng)商設(shè)備封裝: 44-MQFP(10x10)
包裝: 托盤
TC530/TC534
DS21433C-page 20
2007 Microchip Technology Inc.
40-Lead Plastic Dual In-Line (PL) – 600 mil Body [PDIP]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units
INCHES
Dimension Limits
MIN
NOM
MAX
Number of Pins
N
40
Pitch
e
.100 BSC
Top to Seating Plane
A
.250
Molded Package Thickness
A2
.125
.195
Base to Seating Plane
A1
.015
Shoulder to Shoulder Width
E
.590
.625
Molded Package Width
E1
.485
.580
Overall Length
D
1.980
2.095
Tip to Seating Plane
L
.115
.200
Lead Thickness
c
.008
.015
Upper Lead Width
b1
.030
.070
Lower Lead Width
b
.014
.023
Overall Row Spacing §
eB
.700
N
NOTE 1
E1
D
12 3
A
A1
b1
b
e
c
eB
E
L
A2
Microchip Technology Drawing C04-016B
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