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參數(shù)資料
| 型號： | TC534CPL |
| 廠商： | Microchip Technology |
| 文件頁數(shù)： | 10/28頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC DATA ACQ SUBSYSTEM 40DIP |
| 標(biāo)準(zhǔn)包裝： | 10 |
| 類型： | 數(shù)據(jù)采集系統(tǒng)（DAS） |
| 分辨率（位）： | 17 b |
| 采樣率（每秒）： | 6.5 |
| 數(shù)據(jù)接口： | 串行 |
| 電壓電源： | 單電源 |
| 電源電壓： | 4.5 V ~ 5.5 V |
| 工作溫度： | 0°C ~ 70°C |
| 安裝類型： | 通孔 |
| 封裝/外殼： | 40-DIP（0.600"，15.24mm） |
| 供應(yīng)商設(shè)備封裝： | 40-PDIP |
| 包裝： | 管件 |
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TC530/TC534
DS21433C-page 18
2007 Microchip Technology Inc.
28-Lead Skinny Plastic Dual In-Line (PJ) – 300 mil Body [SPDIP]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units
INCHES
Dimension Limits
MIN
NOM
MAX
Number of Pins
N
28
Pitch
e
.100 BSC
Top to Seating Plane
A
–
.200
Molded Package Thickness
A2
.120
.135
.150
Base to Seating Plane
A1
.015
–
Shoulder to Shoulder Width
E
.290
.310
.335
Molded Package Width
E1
.240
.285
.295
Overall Length
D
1.345
1.365
1.400
Tip to Seating Plane
L
.110
.130
.150
Lead Thickness
c
.008
.010
.015
Upper Lead Width
b1
.040
.050
.070
Lower Lead Width
b
.014
.018
.022
Overall Row Spacing §
eB
–
.430
NOTE 1
N
12
D
E1
eB
c
E
L
A2
e
b
b1
A1
A
3
Microchip Technology Drawing C04-070B
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