參數(shù)資料
型號(hào)： TC534CPL
廠商： Microchip Technology
文件頁(yè)數(shù)： 11/28頁(yè)
文件大?。?/td> 0K
描述： IC DATA ACQ SUBSYSTEM 40DIP
標(biāo)準(zhǔn)包裝： 10
類型： 數(shù)據(jù)采集系統(tǒng)（DAS）
分辨率（位）： 17 b
采樣率（每秒）： 6.5
數(shù)據(jù)接口： 串行
電壓電源： 單電源
電源電壓： 4.5 V ~ 5.5 V
工作溫度： 0°C ~ 70°C
安裝類型： 通孔
封裝/外殼： 40-DIP（0.600"，15.24mm）
供應(yīng)商設(shè)備封裝： 40-PDIP
包裝： 管件
2007 Microchip Technology Inc.
DS21433C-page 19
TC530/TC534
28-Lead Plastic Small Outline (OI) – Wide, 7.50 mm Body [SOIC]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units
MILLIMETERS
Dimension Limits
MIN
NOM
MAX
Number of Pins
N
28
Pitch
e
1.27 BSC
Overall Height
A
–
2.65
Molded Package Thickness
A2
2.05
–
Standoff §
A1
0.10
–
0.30
Overall Width
E
10.30 BSC
Molded Package Width
E1
7.50 BSC
Overall Length
D
17.90 BSC
Chamfer (optional)
h
0.25
–
0.75
Foot Length
L
0.40
–
1.27
Footprint
L1
1.40 REF
Foot Angle Top
φ
0°
–
8°
Lead Thickness
c
0.18
–
0.33
Lead Width
b
0.31
–
0.51
Mold Draft Angle Top
α
5°
–
15°
Mold Draft Angle Bottom
β
5°
–
15°
c
h
L
L1
A2
A1
A
NOTE 1
12 3
b
e
E
E1
D
φ
β
α
N
Microchip Technology Drawing C04-052B
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