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參數(shù)資料
| 型號(hào)： | TDA4867 |
| 廠商： | NXP Semiconductors N.V. |
| 英文描述： | Full bridge current driven vertical deflection booster |
| 中文描述： | 全橋電流驅(qū)動(dòng)垂直偏轉(zhuǎn)助推器 |
| 文件頁(yè)數(shù)： | 12/14頁(yè) |
| 文件大小： | 426K |
| 代理商： | TDA4867 |
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2003 Feb 05
12
Philips Semiconductors
Preliminary specification
Full bridge current driven vertical
deflection booster
TDA4867J
PACKAGE OUTLINE
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
EIAJ
DIMENSIONS (mm are the original dimensions)
Notes
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
2. Plastic surface within circle area D1 may protrude 0.04 mm maximum.
SOT523-1
0
10 mm
5
scale
w
M
bp
Dh
q1
Z
1
9
e
e1
m
e2
x
A2
non-concave
D1
P
D
k
q2
L3
L2
L
Q
c
E
98-11-12
00-07-03
DBS9P: plastic DIL-bent-SIL power package; 9 leads (lead length 12/11 mm); exposed die pad
SOT523-1
view
B
: mounting base side
B
UNIT
bp
L1
c
D
(1)
Dh
L
q2
mm
2.7
2.3
A2
(2)
0.80
0.65
0.58
0.48
13.2
12.8
D1
(2)
6.2
5.8
3.5
Eh
3.5
e
2.54
e1
1.27
e2
5.08
4.85
Q
E
(1)
14.7
14.3
Z
(1)
1.65
1.10
11.4
10.0
L2
6.7
5.5
L3
4.5
3.7
3.4
3.1
1.15
0.85
q
17.5
16.3
q1
2.8
m
0.8
v
3.8
3.6
3.0
2.0
12.4
11.0
P
k
0.02
x
0.3
w
Eh
L1
q
v
M
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|---|---|
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