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參數(shù)資料
| 型號： | TEA1506 |
| 廠商： | NXP Semiconductors N.V. |
| 英文描述： | GreenChip SMPS control IC |
| 中文描述： | 綠色芯片開關(guān)電源控制IC |
| 文件頁數(shù)： | 19/22頁 |
| 文件大?。?/td> | 122K |
| 代理商： | TEA1506 |
2003 Sep 09
19
Philips Semiconductors
Product specification
GreenChip
II SMPS control IC
TEA1506P; TEA1506AP;
TEA1506T; TEA1506AT
SOLDERING
Introduction
Thistextgivesaverybriefinsighttoacomplextechnology.
A more in-depth account of soldering ICs can be found in
our “Data Handbook IC26; Integrated Circuit Packages”
(document order number 9398 652 90011).
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-holeandsurfacemountcomponentsaremixedon
one printed-circuit board. Wave soldering can still be used
for certain surface mount ICs, but it is not suitable for fine
pitch SMDs. In these situations reflow soldering is
recommended. Driven by legislation and environmental
forces the worldwide use of lead-free solder pastes is
increasing.
Through-hole mount packages
S
OLDERING BY DIPPING OR BY SOLDER WAVE
Typical dwell time of the leads in the wave ranges from
3 to 4 seconds at 250
°
C or 265
°
C, depending on solder
material applied, SnPb or Pb-free respectively.
Thetotalcontacttimeofsuccessivesolderwavesmustnot
exceed 5 seconds.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (T
stg(max)
). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
M
ANUAL SOLDERING
Apply the soldering iron (24 V or less) to the lead(s) of the
package, either below the seating plane or not more than
2 mm above it. If the temperature of the soldering iron bit
is less than 300
°
C it may remain in contact for up to
10 seconds. If the bit temperature is between
300 and 400
°
C, contact may be up to 5 seconds.
Surface mount packages
R
EFLOW SOLDERING
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
Several methods exist for reflowing; for example,
convection or convection/infrared heating in a conveyor
type oven. Throughput times (preheating, soldering and
cooling) vary between 100 and 200 seconds depending
on heating method.
Typical reflow peak temperatures range from
215 to 270
°
C depending on solder paste material. The
top-surface temperature of the packages should
preferably be kept:
below 220
°
C (SnPb process) or below 245
°
C (Pb-free
process)
– for all the BGA and SSOP-T packages
– for packages with a thickness
≥
2.5 mm
– for packages with a thickness < 2.5 mm and a
volume
≥
350 mm
3
so called thick/large packages.
below 235
°
C (SnPb process) or below 260
°
C (Pb-free
process) for packages with a thickness < 2.5 mm and a
volume < 350 mm
3
so called small/thin packages.
Moisture sensitivity precautions, as indicated on packing,
must be respected at all times.
W
AVE SOLDERING
Conventional single wave soldering is not recommended
forsurfacemountdevices(SMDs)orprinted-circuitboards
with a high component density, as solder bridging and
non-wetting can present major problems.
To overcome these problems the double-wave soldering
method was specifically developed.
If wave soldering is used the following conditions must be
observed for optimal results:
Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.
For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint
longitudinal axis is
preferred
to be parallel to the
transport direction of the printed-circuit board;
– smaller than 1.27 mm, the footprint longitudinal axis
must
be parallel to the transport direction of the
printed-circuit board.
The footprint must incorporate solder thieves at the
downstream end.
Forpackageswithleadsonfoursides,thefootprintmust
be placed at a 45
°
angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| TEA1506AP | GreenChip SMPS control IC |
| TEA1506AT | GreenChip SMPS control IC |
| TEA1506P | GreenChip SMPS control IC |
| TEA1506T | GreenChip SMPS control IC |
| TEA152X | STARplug |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| TEA1506AP | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:GreenChip SMPS control IC |
| TEA1506AP/N1,112 | 功能描述:IC CONTROLLER SMPS 8-DIP RoHS:是 類別:集成電路 (IC) >> PMIC - AC-DC 轉(zhuǎn)換器，離線開關(guān) 系列:GreenChip™ II 標(biāo)準(zhǔn)包裝:1 系列:FPS™ 輸出隔離:隔離 頻率范圍:61kHz ~ 73kHz 輸入電壓:8 V ~ 26 V 輸出電壓:650V 功率（瓦特）:12W 工作溫度:-40°C ~ 115°C 封裝/外殼:8-DIP（0.300"，7.62mm） 供應(yīng)商設(shè)備封裝:8-MDIP 包裝:Digi-Reel® 其它名稱:FSL206MRBNFSDKR |
| TEA1506AT | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:GreenChip SMPS control IC |
| TEA1506AT/N1,118 | 功能描述:DC/DC 開關(guān)控制器 IC SMPS CONTROLLER RoHS:否 制造商:Texas Instruments 輸入電壓:6 V to 100 V 開關(guān)頻率: 輸出電壓:1.215 V to 80 V 輸出電流:3.5 A 輸出端數(shù)量:1 最大工作溫度:+ 125 C 安裝風(fēng)格: 封裝 / 箱體:CPAK |
| TEA1506AT/N1,518 | 功能描述:DC/DC 開關(guān)控制器 TEA1506AT/SO14/REEL13DP//N1 RoHS:否 制造商:Texas Instruments 輸入電壓:6 V to 100 V 開關(guān)頻率: 輸出電壓:1.215 V to 80 V 輸出電流:3.5 A 輸出端數(shù)量:1 最大工作溫度:+ 125 C 安裝風(fēng)格: 封裝 / 箱體:CPAK |
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