參數(shù)資料
型號(hào): TGA2904-FL
廠(chǎng)商: TRIQUINT SEMICONDUCTOR INC
元件分類(lèi): 衰減器
英文描述: Ku Band 2 Watt Packaged Amplifier
中文描述: 13000 MHz - 17000 MHz RF/MICROWAVE WIDE BAND HIGH POWER AMPLIFIER
封裝: 0.700 X 0.330 INCH, 0.100 INCH HEIGHT, ROHS COMPLIANT PACKAGE-10
文件頁(yè)數(shù): 7/7頁(yè)
文件大小: 159K
代理商: TGA2904-FL
Advance Product Information
April 5, 2006
TGA2904-FL
7
TriQuint Semiconductor Texas Phone: (972)994 8465 Fax: (972)994 8504 Web: www.triquint.com Info:
info-mmw@tqs.com
Assembly of a TGA2904-FL Surface Mount Package onto a Motherboard
Manual Assembly for Prototypes
1. Clean the motherboard or the similar module with Acetone. Rinse with alcohol and DI water. Allow the circuit
to fully dry.
2. To improve the thermal and RF performance, we recommend a heat sink attach to the bottom of the package
and apply indium alloy SN63 solder or Tin Lead solder to the bottom of TGA2904-FL
3. Apply Tin Lead solder to each pin of TGA2904-FL.
4 Clean the assembly with alcohol.
High Volume Assembly of the Package
The TGA2904-FL is a custom leaded packaged component. High volume assembly can be performed using
standard assembly processes including solder printing such as stencil solder printing. Pick-and-place using a
standard machine such as a MRSI machine, and solder reflow using a “Sikama Reflow System” using typical
zone temperatures: 120, 175, 195, and 215 degrees Celsuis at 15 second intervals.
Ordering Information
Part
Package Style
TGA2904-FL
Flange Lead
GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should
be observed during handling, assembly and test.
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