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| 型號(hào)： | THS3091DDA |
| 廠商： | TEXAS INSTRUMENTS INC |
| 元件分類(lèi)： | 音頻／視頻放大 |
| 英文描述： | 1 CHANNEL, VIDEO AMPLIFIER, PDSO8 |
| 封裝： | GREEN, PLASTIC, SOP-8 |
| 文件頁(yè)數(shù)： | 17/37頁(yè) |
| 文件大?。?/td> | 1078K |
| 代理商： | THS3091DDA |
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POWER DISSIPATION AND THERMAL
ResultsareWithNo AirFlowandPCBSize=
3inchesx3inches(76,2mmx76,2mm)
DESIGN TOOLS
Evaluation Fixtures, Spice Models, and
P
Dmax
+
Tmax * TA
q
JA
where:
PDmax is the maximum power dissipation in the amplifier (W).
Tmax is the absolute maximum junction temperature (°C).
TA is the ambient temperature (°C).
θJA = θJC + θCA
θJC is the thermal coefficient from the silicon junctions to the
case (
°C/W).
θCA is the thermal coefficient from the case to ambient air
(
°C/W).
SLOS423G – SEPTEMBER 2003 – REVISED OCTOBER 2008........................................................................................................................................ www.ti.com
complete
connection
around
the
entire
above and detailed in the PowerPAD application note
circumference of the plated-through hole.
(SLMA002). The following graph also illustrates the
effect of not soldering the PowerPAD to a PCB. The
6. The top-side solder mask should leave the
thermal impedance increases substantially which may
terminals of the package and the thermal pad
cause serious heat and performance issues. Be sure
area with its 13 holes exposed. The bottom-side
to always solder the PowerPAD to the PCB for
solder mask should cover the 13 holes of the
optimum performance.
thermal pad area. This prevents solder from
being pulled away from the thermal pad area
during the reflow process.
7. Apply solder paste to the exposed thermal pad
area and all of the IC terminals.
8. With these preparatory steps in place, the IC is
simply placed in position and run through the
solder
reflow
operation
as
any
standard
surface-mount component. This results in a part
that is properly installed.
CONSIDERATIONS
The
THS3091/5
incorporates
automatic
thermal
shutoff protection. This protection circuitry shuts down
the amplifier if the junction temperature exceeds
approximately 160°C. When the junction temperature
reduces to approximately 140°C, the amplifier turns
on
again.
But,
for
maximum
performance
and
reliability, the designer must ensure that the design
does not exceed a junction temperature of 125°C.
Between 125°C and 150°C, damage does not occur,
Figure 73. Maximum Power Distribution vs
but the performance of the amplifier begins to
Ambient Temperature
degrade and long-term reliability suffers. The thermal
characteristics of the device are dictated by the
When determining whether or not the device satisfies
package
and
the
PC
board.
Maximum
power
the maximum power dissipation requirement, it is
dissipation for a given package can be calculated
important to consider not only quiescent power
using the following formula.
dissipation, but also dynamic power dissipation. Often
times, this is difficult to quantify because the signal
pattern is inconsistent, but an estimate of the RMS
power dissipation can provide visibility into a possible
problem.
Application Support
Texas Instruments is committed to providing its
customers with the highest quality of applications
support. To support this goal, an evaluation board
has been developed for the THS3091/5 operational
amplifier. The board is easy to use, allowing for
For systems where heat dissipation is more critical,
straightforward
evaluation
of
the
device.
The
the THS3091 and THS3095 are offered in an 8-pin
evaluation board can be ordered through the Texas
SOIC (DDA) with PowerPAD package. The thermal
Instruments Web site, www.ti.com, or through your
coefficient
for
the
PowerPAD
packages
are
local Texas Instruments sales representative.
substantially improved over the traditional SOIC.
Maximum power dissipation levels are depicted in the
Computer simulation of circuit performance using
graph for the available packages. The data for the
SPICE
is
often
useful
when
analyzing
the
PowerPAD packages assume a board layout that
performance of analog circuits and systems. This is
follows the PowerPAD layout guidelines referenced
particularly true for video and RF-amplifier circuits
24
Copyright 2003–2008, Texas Instruments Incorporated
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PDF描述 |
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| THS3091D | 1 CHANNEL, VIDEO AMPLIFIER, PDSO8 |
| THS3091DRG4 | 1 CHANNEL, VIDEO AMPLIFIER, PDSO8 |
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| THS3091DDA | 制造商:Texas Instruments 功能描述:IC OP AMP CFB SMD 3091 HSOP8 |
| THS3091DDAG3 | 功能描述:高速運(yùn)算放大器 Single Lo-Distort Current Feedback RoHS:否 制造商:Texas Instruments 通道數(shù)量:1 電壓增益 dB:116 dB 輸入補(bǔ)償電壓:0.5 mV 轉(zhuǎn)換速度:55 V/us 工作電源電壓:36 V 電源電流:7.5 mA 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SOIC-8 封裝:Tube |
| THS3091DDAR | 功能描述:高速運(yùn)算放大器 Single Lo-Distort Current Feedback RoHS:否 制造商:Texas Instruments 通道數(shù)量:1 電壓增益 dB:116 dB 輸入補(bǔ)償電壓:0.5 mV 轉(zhuǎn)換速度:55 V/us 工作電源電壓:36 V 電源電流:7.5 mA 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SOIC-8 封裝:Tube |
| THS3091DDARG3 | 功能描述:高速運(yùn)算放大器 Single Lo-Distort Current Feedback RoHS:否 制造商:Texas Instruments 通道數(shù)量:1 電壓增益 dB:116 dB 輸入補(bǔ)償電壓:0.5 mV 轉(zhuǎn)換速度:55 V/us 工作電源電壓:36 V 電源電流:7.5 mA 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SOIC-8 封裝:Tube |
| THS3091DG4 | 功能描述:高速運(yùn)算放大器 Single Lo-Distort Current Feedback RoHS:否 制造商:Texas Instruments 通道數(shù)量:1 電壓增益 dB:116 dB 輸入補(bǔ)償電壓:0.5 mV 轉(zhuǎn)換速度:55 V/us 工作電源電壓:36 V 電源電流:7.5 mA 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SOIC-8 封裝:Tube |
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