參數(shù)資料
型號(hào): THS4302EVM
廠商: Texas Instruments, Inc.
英文描述: THS4302 Evalutation Module(THS4302評(píng)估板)
中文描述: THS4302 Evalutation模塊(THS4302評(píng)估板)
文件頁數(shù): 19/25頁
文件大?。?/td> 674K
代理商: THS4302EVM
www.ti.com
DESIGN TOOLS
Evaluation
Information
Fixtures
and
Application
Support
P
Dmax
T
max
–T
A
JA
where
:
P
Dmax
is the maximum power dissipation in the amplifier (W).
T
max
is the absolute maximum junction temperature (
°
C)
.
T
A
is the ambient temperature (
°
C).
θ
JA
=
θ
JC
+
θ
CA
θ
JC
is the thermal coefficient from the silicon junctions to
the case (
°
C/W).
θ
CA
is the thermal coefficient from the case to ambient air
(
°
C/W).
4
3
2
0
-40
-20
T
A
- Ambient Temperature -
°
C
0
20
-
P
5
6
7
40
60
80
16-Pin RGT Package
θ
JA
= 39.5
°
C/W for 16-Pin MSOP (RGT)
T
J
= 150
°
C, No Airflow
1
THS4302
SLOS403F–OCTOBER 2002–REVISED FEBRUARY 2004
The thermal characteristics of the device are dictated
by the package and the PC board. For a given
Θ
JA
,
maximum power dissipation for a package can be
calculated using the following formula.
Texas Instruments is committed to providing its cus-
tomers with the highest quality of applications sup-
port. To support this goal, an evaluation board has
been developed for the THS4302 operational ampli-
fier. The evaluation board is available and easy to
use allowing for straight-forward evaluation of the
device. This evaluation board can be obtained by
ordering through the Texas Instruments Web site,
www.ti.com, or through your local Texas Instruments
Sales Representative. A schematic for the evaluation
board with default component values is shown in
Figure 52. Unpopulated footprints are shown to pro-
vide insight into design flexibility
(1)
The THS4302 is offered in a 16-pin leadless MSOP
with PowerPAD. The thermal coefficient for the
MSOP PowerPAD package is substantially improved
over
the
traditional
packages.
dissipation levels are depicted in the graph below.
The data for the RGT package assumes a board
layout that follows the PowerPAD layout guidelines
referenced above and detailed in the PowerPAD
application notes in the
Additional Reference Material
section at the end of the data sheet.
Computer simulation of circuit performance using
SPICE is often useful when analyzing the perform-
ance of analog circuits and systems. This is particu-
larly true for video and RF amplifier circuits where
parasitic capacitance and inductance can have a
major effect on circuit performance. A SPICE model
for the THS4302 device is available through either
the Texas Instruments Web site (www.ti.com) or as
one model on a disk from the Texas Instruments
Product Information Center (1-800-548-6132). The
PIC is also available for design assistance and
detailed product information at this number. These
models do a good job of predicting small signal ac
and transient performance under a wide variety of
operating conditions. They are not intended to model
the distortion characteristics of the amplifier, nor do
they attempt to distinguish between the package
types in their small signal ac performance. Detailed
information about what is and is not modeled is
contained in the model file itself.
Maximum
power
Figure 51. Maximum Power Dissipation vs
Ambient Temperature
When determining whether or not the device satisfies
the maximum power dissipation requirement, it is
important to consider not only quiescent power dissi-
pation, but also dynamic power dissipation. Often
maximum power is difficult to quantify because the
signal pattern is inconsistent, but an estimate of the
RMS power dissipation can provide visibility into a
possible problem.
19
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