參數(shù)資料
型號: THS7319IZSVR
廠商: Texas Instruments
文件頁數(shù): 16/33頁
文件大?。?/td> 0K
描述: IC EDTV VIDEO AMP 3CH 9UCSP
標準包裝: 2,500
應(yīng)用: 緩沖器
輸出類型: 滿擺幅
電路數(shù): 3
-3db帶寬: 20MHz
轉(zhuǎn)換速率: 80 V/µs
電流 - 電源: 3.4mA
電流 - 輸出 / 通道: 70mA
電壓 - 電源,單路/雙路(±): 2.5 V ~ 5.5 V
安裝類型: 表面貼裝
封裝/外殼: 9-UltraCSP?(Xcept)
供應(yīng)商設(shè)備封裝: 9-UCSP
包裝: 帶卷 (TR)
PRINTED WIRING BOARD (PWB) DESIGN GUIDE
CopperTrace
Width
SolderMaskThickness
SolderPadWidth
SolderMaskOpening
CopperTraceThickness
www.ti.com.............................................................................................................................................................. SBOS468A – JUNE 2009 – REVISED JULY 2009
the solder mask opening is made larger than the
When designing the pad size for the MicrostarCSP, it
desired land area, and the opening size is defined by
is recommended that the layout use a non-solder
the copper pad width. Figure 53 and Table 2 define
mask defined (NSMD) landing pad. With this method,
the land pattern recommendations. Figure 54 and
Table 3 show a trace width example.
Figure 53. Land Pattern Recommendations
Table 2. Definitions for Figure 53
SOLDER MASK
SOLDER PAD
COPPER PAD
OPENING
STENCIL OPENING
STENCIL THICKNESS
Non-solder mask defined
250
m × 250 m square
200
m to 275 m
Copper pad + 50
m
100
m
(NSMD)
(rounded corners)
Copyright 2009, Texas Instruments Incorporated
23
Product Folder Link(s): THS7319
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