MinSpace S T TraceWidth MetalDiameter SeeDimension or A C X Pitch Y Pitch THS7319 SBOS468A " />
參數(shù)資料
型號(hào)： THS7319IZSVR
廠商： Texas Instruments
文件頁(yè)數(shù)： 17/33頁(yè)
文件大?。?/td> 0K
描述： IC EDTV VIDEO AMP 3CH 9UCSP
標(biāo)準(zhǔn)包裝： 2,500
應(yīng)用： 緩沖器
輸出類(lèi)型： 滿(mǎn)擺幅
電路數(shù)： 3
-3db帶寬： 20MHz
轉(zhuǎn)換速率： 80 V/µs
電流 - 電源： 3.4mA
電流 - 輸出 / 通道： 70mA
電壓 - 電源，單路/雙路(±)： 2.5 V ~ 5.5 V
安裝類(lèi)型： 表面貼裝
封裝/外殼： 9-UltraCSP?（Xcept）
供應(yīng)商設(shè)備封裝： 9-UCSP
包裝： 帶卷 (TR)
MinSpace S
T TraceWidth
MetalDiameter
SeeDimension
or
A
C
X Pitch
Y Pitch
SBOS468A – JUNE 2009 – REVISED JULY 2009.............................................................................................................................................................. www.ti.com
(1) Circuit traces from the NSMD-defined PWB lands should be 75-
m to 100-m wide in the exposed area inside the solder mask opening.
Wider trace widths reduce device stand-off and impact reliability.
(2) Best reliability results are achieved when the PWB laminate glass transition temperature is greater than the operating temperature range
of the intended application.
(3) For a PWB using a Ni/Au surface-finish, the Au thickness should be less than 0.5
m to avoid a reduction in thermal fatigue performance.
(4) Solder mask thickness should be less than 20
m above the copper circuit pattern.
(5) Best solder stencil performance is achieved using laser-cut stencils with electro-polishing. Use of chemically-etched stencils results in
inferior solder-paste volume control.
(6) Trace routing away from the MicrostarCSP device should be balanced in X and Y directions to avoid unintentional component movement
because of solder wetting forces.
Figure 54. Trace Width/Spacing Example
Table 3. Definitions for Figure 54
(S or T) TRACE
PAD
PACKAGE PITCH
(A or C) METAL DIAMETER
WIDTH/SPACING
NSMD
0.50 mm
0.25 mm
0.08 mm
24
Copyright 2009, Texas Instruments Incorporated
Product Folder Link(s): THS7319
相關(guān)PDF資料
PDF描述
TLC0838CDW IC 8-BIT SERIAL OUT A/D 20-SOIC
TLC2551IDG4 IC ADC 12BIT SER 400K 8SOIC
TLV1549IDRG4 IC ADC 10BIT SER 38K 8SOIC
TLV2354IDG4 IC DIFF COMPARATOR QUAD 14-SOIC
TLV2542IDG4 IC ADC 12BIT SER 200K 8SOIC
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
THS7319IZSVT 功能描述:視頻放大器 3Ch Very Lo Pwr Lo Prof EDTV Video Amp RoHS:否 制造商:ON Semiconductor 通道數(shù)量:4 電源類(lèi)型: 工作電源電壓:3.3 V, 5 V 電源電流: 最小工作溫度: 最大工作溫度: 封裝 / 箱體:TSSOP-14 封裝:Reel
THS7320 制造商:TI 制造商全稱(chēng):Texas Instruments 功能描述:3-Channel ED Filter Video Amplifier with 4-V/V Gain
THS7320IYHCR 制造商:Texas Instruments 功能描述:3-CHANL ED FILTER VIDEO AMP, 4V/V GAIN - Tape and Reel 制造商:Texas Instruments 功能描述:IC 3-CH INTEG VIDEO AMP 9DSBGA 制造商:Texas Instruments 功能描述:Video Amplifiers 3-Ch ED Fltr Video Amp w/ 4V/V Gain 制造商:Texas Instruments 功能描述:3-Chanl ED Filter Video Amp, 4V/V Gain
THS7320IYHCT 制造商:Texas Instruments 功能描述:IC 3-CH INTEG VIDEO AMP 9DSBGA
THS7320YHCEVM 制造商:Texas Instruments 功能描述:THS7320YHCEVM - Boxed Product (Development Kits) 制造商:Texas Instruments 功能描述:Texas Instruments THS7320YHCEVM Development Kits 制造商:Texas Instruments 功能描述:MODULE EVAL FOR THS7320 ZSV 制造商:Texas Instruments 功能描述:EVAL BOARD, THS7320 VIDEO AMPLIFIER, Silicon Manufacturer:Texas Instruments, Silicon Core Number:THS7320, Kit Application Type:Amplifier, Application Sub Type:Video Buffer and Filter, Kit Contents:Eval Board THS7320
發(fā)布緊急采購(gòu)，3分鐘左右您將得到回復(fù)。

采購(gòu)需求

(若只采購(gòu)一條型號(hào)，填寫(xiě)一行即可)

發(fā)布成功！您可以繼續(xù)發(fā)布采購(gòu)。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

發(fā)布成功！您可以繼續(xù)發(fā)布采購(gòu)。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

*型號(hào) *數(shù)量 廠商 批號(hào) 封裝
添加更多采購(gòu)

我的聯(lián)系方式

*
*
*