參數(shù)資料
型號(hào)： TLV320AIC26IRHB
廠商： Texas Instruments, Inc.
元件分類： Codec
英文描述： LOW POWER STEREO AUDIO CODEC WITH HEADPHONE/SPEAKER AMPLIFIER AND 12-BIT BATTERY / TEMPERATURE / AUXILIARY ADC
中文描述： 低功耗立體聲音頻編解碼器耳機(jī)/揚(yáng)聲器放大器和12位電池/溫度/輔助ADC
文件頁數(shù)： 23/74頁
文件大小： 896K
代理商： TLV320AIC26IRHB
TLV320AIC26
SLAS412 DECEMBER 2003
www.ti.com
3
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range unless otherwise noted(1)(2)
UNITS
AVDD to AVSS
0.3 V to 3.9 V
DRVDD to DRVSS
0.3 V to 3.9 V
IOVDD to DVSS
0.3 V to 3.9 V
DVDD to DVSS
0.3 V to 2.5 V
AVDD to DRVDD
0.1 V to 0.1 V
AVSS to DRVSS to DVSS
0.1 V to 0.1 V
Analog inputs (except VBAT1 and VBAT2) to AVSS
0.3 V to AVDD + 0.3 V
VBAT1 / VBAT2 to AVSS
0.3 V to 6 V
Digital input voltage to DVSS
0.3 V to IOVDD + 0.3 V
Operating temperature range
40
°C to 85°C
Storage temperature range
65
°C to 105°C
Junction temperature (TJ Max)
105
°C
QFN package
Power dissipation
(TJ Max TA)/θJA
QFN package
θJA Thermal impedance
123
°C/W
Lead temperature
Soldering vapor phase (60 sec)
215
°C
Lead temperature
Infrared (15 sec)
220
°C
(1) Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) If the ’AIC26 is used to drive high power levels to an 8- load for extended intervals at ambient temperatures above 70°C, multiple vias should be
used to electrically and thermally connect the thermal pad on the QFN package to an internal heat-dissipating ground plane on the user’s PCB.
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