參數資料
型號： TMS320C6415TBGLZA6
廠商： Texas Instruments
文件頁數： 9/146頁
文件大?。?/td> 0K
描述： IC FIXED-POINT DSP 532-FCBGA
標準包裝： 60
系列： TMS320C6414T/15T/16T
類型： 定點
接口： 主機接口，McBSP，PCI，UTOPIA
時鐘速率： 600MHz
非易失內存： 外部
芯片上RAM： 1.03MB
電壓 - 輸入/輸出： 3.30V
電壓 - 核心： 1.10V
工作溫度： -40°C ~ 105°C
安裝類型： 表面貼裝
封裝/外殼： 532-BFBGA，F(xiàn)CBGA
供應商設備封裝： 532-FCBGA（23x23）
包裝： 托盤
配用： TMDXEVM6452-ND - TMDXEVM6452
296-23038-ND - DSP STARTER KIT FOR TMS320C6416
TMS320C6414T, TMS320C6415T, TMS320C6416T
FIXEDPOINT DIGITAL SIGNAL PROCESSORS
SPRS226M NOVEMBER 2003 REVISED APRIL 2009
106
POST OFFICE BOX 1443
HOUSTON, TEXAS 772511443
RESET TIMING
timing requirements for reset (see Figure 37)
NO.
600, 720,
850, 1G
UNIT
NO.
MIN
MAX
UNIT
1
tw(RST)
Width of the RESET pulse (PLL stable)
250
s
1
tw(RST)
Width of the RESET pulse (PLL needs to sync up)§
250
s
16
tsu(boot)
Setup time, boot configuration bits valid before RESET high
4E or 4C#
ns
17
th(boot)
Hold time, boot configuration bits valid after RESET high
4P
ns
18
tsu(PCLK-RSTH) Setup time, PCLK active before RESET high||
32N
ns
P = 1/CPU clock frequency in ns. For example, when running parts at 720 MHz, use P = 1.39 ns.
This parameter applies to CLKMODE x1 when CLKIN is stable, and applies to CLKMODE x6, x12, x20 when CLKIN and PLL are stable.
§ This parameter applies to CLKMODE x6, x12, x20 only (it does not apply to CLKMODE x1). The RESET signal is not connected internally to
the clock PLL circuit. The PLL, however, may need up to 250
s to stabilize following device power up or after PLL configuration has been
changed. During that time, RESET must be asserted to ensure proper device operation. See the clock PLL section for PLL lock times.
EMIFB address pins BEA[20:13, 11, 9:7] are the boot configuration pins during device reset.
# E = 1/AECLKIN clock frequency in ns. C = 1/CLKIN clock frequency in ns. Select whichever value is larger for the MIN parameter.
|| N = the PCI input clock (PCLK) period in ns. When PCI is enabled (PCI_EN = 1), this parameter must be met.
switching characteristics over recommended operating conditions during resetkh (see Figure 37)
NO.
PARAMETER
600, 720,
850, 1G
UNIT
NO.
PARAMETER
MIN
MAX
UNIT
2
td(RSTL-ECKI)
Delay time, RESET low to ECLKIN synchronized internally
2E
3P + 20E
ns
3
td(RSTH-ECKI)
Delay time, RESET high to ECLKIN synchronized internally
2E
16 070P
ns
4
td(RSTL-ECKO1HZ)
Delay time, RESET low to ECLKOUT1 high impedance
2E
ns
5
td(RSTH-ECKO1V)
Delay time, RESET high to ECLKOUT1 valid
16 070P
ns
6
td(RSTL-EMIFZHZ)
Delay time, RESET low to EMIF Z high impedance
2E
3P + 4E
ns
7
td(RSTH-EMIFZV)
Delay time, RESET high to EMIF Z valid
16E
16 070P
ns
8
td(RSTL-EMIFHIV)
Delay time, RESET low to EMIF high group invalid
2E
ns
9
td(RSTH-EMIFHV)
Delay time, RESET high to EMIF high group valid
16 070P
ns
10
td(RSTL-EMIFLIV)
Delay time, RESET low to EMIF low group invalid
2E
ns
11
td(RSTH-EMIFLV)
Delay time, RESET high to EMIF low group valid
16 070P
ns
12
td(RSTL-LOWIV)
Delay time, RESET low to low group invalid
0
ns
13
td(RSTH-LOWV)
Delay time, RESET high to low group valid
16 070P
ns
14
td(RSTL-ZHZ)
Delay time, RESET low to Z group high impedance
0
ns
15
td(RSTH-ZV)
Delay time, RESET high to Z group valid
2P
16 070P
ns
P = 1/CPU clock frequency in ns. For example, when running parts at 720 MHz, use P = 1.39 ns.
kE = the EMIF input clock (ECLKIN, CPU/4 clock, or CPU/6 clock) period in ns for EMIFA or EMIFB.
hEMIF Z group consists of:
AEA[22:3], BEA[20:1], AED[63:0], BED[15:0], CE[3:0], ABE[7:0], BBE[1:0], ARE/SDCAS/SADS/SRE,
AWE/SDWE/SWE, and AOE/SDRAS/SOE, SOE3, ASDCKE, and PDT.
EMIF high group consists of: AHOLDA and BHOLDA (when the corresponding HOLD input is high)
EMIF low group consists of:
ABUSREQ and BBUSREQ; AHOLDA and BHOLDA (when the corresponding HOLD input is low)
Low group consists of:
XSP_CS, CLKX2/XSP_CLK, and DX2/XSP_DO; all of which apply only when PCI EEPROM (BEA13)
is enabled (with PCI_EN = 1 and MCBSP2_EN = 0). Otherwise, the CLKX2/XSP_CLK and DX2/XSP_DO
pins are in the Z group. For more details on the PCI configuration pins, see the Device Configurations section
of this data sheet.
Z group consists of:
HD[31:0]/AD[31:0], CLKX0, CLKX1/URADDR4, CLKX2/XSP_CLK, FSX0, FSX1/UXADDR3, FSX2, DX0,
DX1/UXADDR4, DX2/XSP_DO, CLKR0, CLKR1/URADDR2, CLKR2, FSR0, FSR1/UXADDR2, FSR2,
TOUT0, TOUT1, TOUT2, GP[8:0], GP10/PCBE3, HR/W/PCBE2, HDS2/PCBE1, PCBE0, GP13/PINTA,
GP11/PREQ, HDS1/PSERR, HCS/PPERR, HCNTL1/PDEVSEL, HAS/PPAR, HCNTL0/PSTOP,
HHWIL/PTRDY (16-bit HPI mode only), HRDY/PIRDY, HINT/PFRAME, UXDATA[7:0], UXSOC, UXCLAV,
and URCLAV.
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TMS320C6415TBGLZA7 功能描述:數字信號處理器和控制器 - DSP, DSC Fixed-Pt Dig Sig Proc RoHS:否 制造商:Microchip Technology 核心:dsPIC 數據總線寬度:16 bit 程序存儲器大小:16 KB 數據 RAM 大小:2 KB 最大時鐘頻率:40 MHz 可編程輸入/輸出端數量:35 定時器數量:3 設備每秒兆指令數:50 MIPs 工作電源電壓:3.3 V 最大工作溫度:+ 85 C 封裝 / 箱體:TQFP-44 安裝風格:SMD/SMT
TMS320C6415TBGLZA8 功能描述:數字信號處理器和控制器 - DSP, DSC Fixed-Pt Dig Sig Proc RoHS:否 制造商:Microchip Technology 核心:dsPIC 數據總線寬度:16 bit 程序存儲器大小:16 KB 數據 RAM 大小:2 KB 最大時鐘頻率:40 MHz 可編程輸入/輸出端數量:35 定時器數量:3 設備每秒兆指令數:50 MIPs 工作電源電壓:3.3 V 最大工作溫度:+ 85 C 封裝 / 箱體:TQFP-44 安裝風格:SMD/SMT
TMS320C6415TBGLZW8 制造商:Texas Instruments 功能描述:
TMS320C6415TBZLZ1 功能描述:數字信號處理器和控制器 - DSP, DSC Fixed-Pt Dig Sig Proc RoHS:否 制造商:Microchip Technology 核心:dsPIC 數據總線寬度:16 bit 程序存儲器大小:16 KB 數據 RAM 大小:2 KB 最大時鐘頻率:40 MHz 可編程輸入/輸出端數量:35 定時器數量:3 設備每秒兆指令數:50 MIPs 工作電源電壓:3.3 V 最大工作溫度:+ 85 C 封裝 / 箱體:TQFP-44 安裝風格:SMD/SMT
TMS320C6415TBZLZ6 功能描述:數字信號處理器和控制器 - DSP, DSC Fixed-Pt Dig Sig Proc RoHS:否 制造商:Microchip Technology 核心:dsPIC 數據總線寬度:16 bit 程序存儲器大小:16 KB 數據 RAM 大小:2 KB 最大時鐘頻率:40 MHz 可編程輸入/輸出端數量:35 定時器數量:3 設備每秒兆指令數:50 MIPs 工作電源電壓:3.3 V 最大工作溫度:+ 85 C 封裝 / 箱體:TQFP-44 安裝風格:SMD/SMT
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