(Toggling 0VDDIO) XCLKIN/GPIO19/38 X2 NC X1 X2 X1 Crystal " />
參數(shù)資料
型號: TMS320F28069PZPQ
廠商: Texas Instruments
文件頁數(shù): 119/174頁
文件大?。?/td> 0K
描述: IC MCU 32BIT 256KB FLSH 100HTQFP
產(chǎn)品培訓(xùn)模塊: ControlSUITE
Piccolo F2806x
TPS75005 Single IC Power for C2000 MCU
標(biāo)準(zhǔn)包裝: 1,000
系列: TMS320F2806x, Piccolo™, C2000™
核心處理器: C28x
芯體尺寸: 32-位
速度: 80MHz
連通性: CAN,I²C,McBSP,SCI,SPI,UART/USART
外圍設(shè)備: 欠壓檢測/復(fù)位,DMA,POR,PWM,WDT
輸入/輸出數(shù): 54
程序存儲器容量: 256KB(128K x 16)
程序存儲器類型: 閃存
RAM 容量: 50K x 16
電壓 - 電源 (Vcc/Vdd): 1.71 V ~ 1.995 V
數(shù)據(jù)轉(zhuǎn)換器: A/D 16x12b
振蕩器型: 內(nèi)部
工作溫度: -40°C ~ 125°C
封裝/外殼: 100-TQFP 裸露焊盤
包裝: 托盤
External Clock Signal
(Toggling 0VDDIO)
XCLKIN/GPIO19/38
X2
NC
X1
X2
X1
Crystal
XCLKIN/GPIO19/38
Turn off
XCLKIN path
in CLKCTL
register
R
d
C
L1
C
L2
SPRS698D – NOVEMBER 2010 – REVISED DECEMBER 2012
2.9.1
Internal Zero Pin Oscillators
The F2806x devices contain two independent internal zero pin oscillators. By default both oscillators are
turned on at power up, and internal oscillator 1 is the default clock source at this time. For power savings,
unused oscillators may be powered down by the user. The center frequency of these oscillators is
determined by their respective oscillator trim registers, written to in the calibration routine as part of the
boot ROM execution. See Section 5, Peripheral and Electrical Specifications, for more information on
these oscillators.
2.9.2
Crystal Oscillator Option
The typical specifications for the external quartz crystal (fundamental mode, parallel resonant) are listed in
Table 2-14. Furthermore, ESR range = 30 to 150
.
Table 2-14. Typical Specifications for External Quartz Crystal(1)
FREQUENCY (MHz)
Rd ()
CL1 (pF)
CL2 (pF)
5
2200
18
10
470
15
0
15
20
0
12
(1)
Cshunt should be less than or equal to 5 pF.
Figure 2-13. Using the On-chip Crystal Oscillator
NOTE
1. CL1 and CL2 are the total capacitance of the circuit board and components excluding the
IC and crystal. The value is usually approximately twice the value of the crystal's load
capacitance.
2. The load capacitance of the crystal is described in the crystal specifications of the
manufacturers.
3. TI recommends that customers have the resonator/crystal vendor characterize the
operation of their device with the MCU chip. The resonator/crystal vendor has the
equipment and expertise to tune the tank circuit. The vendor can also advise the
customer regarding the proper tank component values that will produce proper start up
and stability over the entire operating range.
Figure 2-14. Using a 3.3-V External Oscillator
Copyright 2010–2012, Texas Instruments Incorporated
Device Overview
49
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