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參數(shù)資料
| 型號(hào)： | TMS32C6205DZHKA200 |
| 廠商： | Texas Instruments |
| 文件頁(yè)數(shù)： | 68/73頁(yè) |
| 文件大?。?/td> | 0K |
| 描述： | IC FIXED POINT DSP 288-BGA |
| 標(biāo)準(zhǔn)包裝： | 1 |
| 系列： | TMS320C62x |
| 類型： | 定點(diǎn) |
| 接口： | McBSP，PCI |
| 時(shí)鐘速率： | 200MHz |
| 非易失內(nèi)存： | 外部 |
| 芯片上RAM： | 128kB |
| 電壓 - 輸入/輸出： | 3.30V |
| 電壓 - 核心： | 1.50V |
| 工作溫度： | -40°C ~ 105°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 288-LFBGA |
| 供應(yīng)商設(shè)備封裝： | 288-BGA Microstar（16x16） |
| 包裝： | 托盤 |
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PACKAGE OPTION ADDENDUM
www.ti.com
11-Sep-2013
Addendum-Page 2
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
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