參數(shù)資料
型號: TMX320F28069PNA
廠商: Texas Instruments
文件頁數(shù): 82/174頁
文件大小: 0K
描述: IC MCU 32BIT 128KB FLASH 80LQFP
產(chǎn)品培訓(xùn)模塊: ControlSUITE
Piccolo F2806x
TPS75005 Single IC Power for C2000 MCU
標(biāo)準(zhǔn)包裝: 1
系列: TMS320F2806x, Piccolo™, C2000™
核心處理器: C28x
芯體尺寸: 32-位
速度: 80MHz
連通性: CAN,I²C,McBSP,SCI,SPI,UART/USART
外圍設(shè)備: 欠壓檢測/復(fù)位,DMA,POR,PWM,WDT
輸入/輸出數(shù): 40
程序存儲器容量: 256KB(128K x 16)
程序存儲器類型: 閃存
RAM 容量: 50K x 16
電壓 - 電源 (Vcc/Vdd): 1.71 V ~ 1.995 V
數(shù)據(jù)轉(zhuǎn)換器: A/D 12x12b
振蕩器型: 內(nèi)部
工作溫度: -40°C ~ 85°C
封裝/外殼: 80-LQFP
包裝: 托盤
PACKAGE OPTION ADDENDUM
www.ti.com
9-Apr-2014
Addendum-Page 5
Orderable Device
Status
(1)
Package Type Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C)
Device Marking
(4/5)
Samples
TMS320F28069UPZPS
ACTIVE
HTQFP
PZP
100
90
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 125
F28069UPZPS
TMS320
TMS320F28069UPZT
ACTIVE
LQFP
PZ
100
90
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 105
F28069UPZT
TMS320
TMX320F28069PNA
ACTIVE
LQFP
PN
80
TBD
Call TI
-40 to 85
TMX320F28069UPFPA
ACTIVE
HTQFP
PFP
80
TBD
Call TI
-40 to 85
TMX320F28069UPZPA
OBSOLETE
HTQFP
PZP
100
TBD
Call TI
-40 to 85
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
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