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參數(shù)資料
| 型號： | TPA6211A1TDGNRQ1 |
| 廠商： | TEXAS INSTRUMENTS INC |
| 元件分類： | 音頻／視頻放大 |
| 英文描述： | AUDIO AMPLIFIER, PDSO8 |
| 封裝： | PLASTIC, MSOP-8 |
| 文件頁數(shù)： | 12/22頁 |
| 文件大小： | 424K |
| 代理商： | TPA6211A1TDGNRQ1 |
SBOS555
– JUNE 2011
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
ORDERING INFORMATION
ORDERABLE PART
TA
PACKAGE
TOP-SIDE MARKING
NUMBER
–40°C to 105°C
HTSSOP - DGN
Tape and Reel
TPA6211A1TDGNRQ1
6211Q
Terminal Functions
TERMINAL
I/O
DESCRIPTION
NAME
NO.
IN-
4
I
Negative differential input
IN+
3
I
Positive differential input
VDD
6
I
Power supply
VO+
5
O
Positive BTL output
GND
7
I
High-current ground
VO-
8
O
Negative BTL output
SHUTDOWN
1
I
Shutdown terminal (active low logic)
BYPASS
2
Mid-supply voltage, adding a bypass capacitor improves PSRR
Connect to ground. Thermal pad must be soldered down in all applications to properly secure
Thermal Pad
-
device on the PCB.
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range unless otherwise noted
(1)
UNIT
VDD
Supply voltage
–0.3 V to 6 V
VI
Input voltage
–0.3 V to VDD + 0.3 V
Continuous total power dissipation
TA
Operating free-air temperature
–40°C to 105°C
TJ
Junction temperature
–40°C to 150°C
Tstg
Storage temperature
–65°C to 150°C
Lead temperature 1,6 mm (1/16 Inch) from case for 10 seconds
DGN
260
°C
(1)
Stresses beyond those listed under
"absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under
"recommended operating
conditions
" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
PACKAGE DISSIPATION RATINGS
TA ≤ 25°C
DERATING
TA= 70°C
TA= 85°C
PACKAGE
POWER RATING
FACTOR(1)
POWER RATING
DGN
2.13 W
17.1 mW/
°C
1.36 W
1.11 W
(1)
Derating factor based on High-k board layout.
2
Copyright
2011, Texas Instruments Incorporated
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